Discussion group dedicated to the Philips LPC2000 family of ARM MCUs
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Dear Friends, I am happy to see that one group is dedicated towards Philips LPC2100. I am trying to build a board based on Philips LPC2106. I am looking for the foot print and library for the LPC2100 for Eagle PCB. I have checked with cadsoft for the same but they haven't uploaded any library for the Philips LPC. Please if anybody has built the library for the same in eagle, let me know because it will be of great help to me. Thanks in advance. LPC's faithfully, Rajneesh |
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>From: "vrrraju" <> >Reply-To: >To: >Subject: [lpc2100] Footprint for LPC >Date: Wed, 11 Feb 2004 17:46:23 -0000 > >Dear Friends, > >I am happy to see that one group is dedicated towards Philips >LPC2100. I am trying to build a board based on Philips LPC2106. I am >looking for the foot print and library for the LPC2100 for Eagle PCB. >I have checked with cadsoft for the same but they haven't uploaded >any library for the Philips LPC. Please if anybody has built the >library for the same in eagle, let me know because it will be of >great help to me. I think there is one in the group's Files area. Leon -- Leon Heller, G1HSM Tel: +44 1424 423947 Email: aqzf13 at dsl dot pipex dot com WWW: http://www.geocities.com/leon_heller _________________________________________________________________ Find a cheaper internet access deal - choose one to suit you. http://www.msn.co.uk/internetaccess |
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--- In , "vrrraju" <vrrraju@y...> wrote: > Dear Friends, > > I am happy to see that one group is dedicated towards Philips > LPC2100. I am trying to build a board based on Philips LPC2106. I am > looking for the foot print and library for the LPC2100 for Eagle PCB. > I have checked with cadsoft for the same but they haven't uploaded > any library for the Philips LPC. Please if anybody has built the > library for the same in eagle, let me know because it will be of > great help to me. > > Thanks in advance. > > LPC's faithfully, > > Rajneesh Hello Rajneesh, have a look at the files link in the yahoo group http://groups.yahoo.com/group/lpc2100/files there are 2 versions of the Eagle library file (and one for Protel) by the way, what kind of application are you doing with the LPC2106? There are also schematics of boards on the link list. Also there are several boards already available e.g. Leon's board http://www.geocities.com/leon_heller/lpc2104.html TinyARM http://www.tinyarm.com/ Ashling http://www.ashling.com/support/lpc2100/index.html IAR http://www.iar.com/Products/?name=KSDKLPC2106 For the LPC2124/LPC2129 Keil http://www.keil.com/mcb2100/ One from Olimex......... So, there are plenty (low-cost) boards for evaluation. Cheers, Bob |
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lpc2100_fan wrote: > There are also schematics of boards on the link list. Also there are > several boards already available e.g. We've also got a Wiki where information is being accumulated whenever I can find it, or somebody else provides: http://www.open-research.org.uk/ARMuC/ ABS |
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or make your own library entry from official philips footprint drawing as i am doing it for LQFP48 package http://www.semiconductors.philips.com/acrobat/packages/footprint/FOOTPRINT-HTQFP-HLQFP-LQFP-REFLOW.pdf (i could not find the footprint for HVQFN48 package...) joseph ----- Original Message ----- From: "Leon Heller" <> To: <> Sent: Wednesday, February 11, 2004 12:55 PM Subject: RE: [lpc2100] Footprint for LPC > > >From: "vrrraju" <> > >Reply-To: > >To: > >Subject: [lpc2100] Footprint for LPC > >Date: Wed, 11 Feb 2004 17:46:23 -0000 > > > >Dear Friends, > > > >I am happy to see that one group is dedicated towards Philips > >LPC2100. I am trying to build a board based on Philips LPC2106. I am > >looking for the foot print and library for the LPC2100 for Eagle PCB. > >I have checked with cadsoft for the same but they haven't uploaded > >any library for the Philips LPC. Please if anybody has built the > >library for the same in eagle, let me know because it will be of > >great help to me. > > I think there is one in the group's Files area. > Leon > -- > Leon Heller, G1HSM Tel: +44 1424 423947 > Email: aqzf13 at dsl dot pipex dot com > WWW: http://www.geocities.com/leon_heller > > _________________________________________________________________ > Find a cheaper internet access deal - choose one to suit you. > http://www.msn.co.uk/internetaccess > Yahoo! Groups Links |
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It's always entertaining to play "find the right footprint". The IPC footprint that most closely matches this is IPC-563A. The difference? Lands are 1.6mm x .3mm vs Philips 1.1mm x .285mm. The width difference isn't very significant, but the length is rather substantial. The typical IPC specs are for MMC or "Maximum Material Condition", which is basically the large end of all dimensions. LMC ("Least Material Condition") doesn't seem to be used much. Supposedly, IPC specs are based on real world manufacturing feedback, and take into account all the little details that relate to making a product manufacturable. That being said, I am/was using the IPC-563A footprint. I'd be interested in hearing the results of people who have had boards made using vapor phase or IR reflow and what pad dimensions they use. This has always been a pet peeve of mine. Some manufactures reference IPC standards, some JEDEC, some have thier own, and some it's just best guess. Given the choice, I'd prefer they adhered to IPC or JEDEC, AND published the spec in the datasheet. National is really good about this. Others are not. Referencing the IPC spec is great, but if you can't afford to spring for the book, you're hosed. Luckily, I found a copy on the web (< http://tinymicros.com/ipc >) from 1999, which has most everything, but does lack TSSOP specs. --jc Joseph Tapay wrote: > or make your own library entry from official philips footprint drawing > as i > am doing it > for LQFP48 package > http://www.semiconductors.philips.com/acrobat/packages/footprint/FOOTPRINT-HTQFP-HLQFP-LQFP-REFLOW.pdf > > (i could not find the footprint for HVQFN48 package...) > > joseph > > ----- Original Message ----- > From: "Leon Heller" <> > To: <> > Sent: Wednesday, February 11, 2004 12:55 PM > Subject: RE: [lpc2100] Footprint for LPC > > > > >From: "vrrraju" <> > > >Reply-To: > > >To: > > >Subject: [lpc2100] Footprint for LPC > > >Date: Wed, 11 Feb 2004 17:46:23 -0000 > > > > > >Dear Friends, > > > > > >I am happy to see that one group is dedicated towards Philips > > >LPC2100. I am trying to build a board based on Philips LPC2106. I am > > >looking for the foot print and library for the LPC2100 for Eagle PCB. > > >I have checked with cadsoft for the same but they haven't uploaded > > >any library for the Philips LPC. Please if anybody has built the > > >library for the same in eagle, let me know because it will be of > > >great help to me. > > > > I think there is one in the group's Files area. > > > > > > Leon > > -- > > Leon Heller, G1HSM Tel: +44 1424 423947 > > Email: aqzf13 at dsl dot pipex dot com > > WWW: http://www.geocities.com/leon_heller > |
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excellent resource, thanks JC i've noticed the shortness of the philips' solder land, so far no rationale to justify it... philips' drawing shows two different width for start/end of row/column (0.30mm) and in between (0.23mm) for LQFP64 package, which is relevant to this group, IPC 565A landing pattern (IPC parlance versus philips "footprint") does not differentiate, hmmm... interesting... The solder vaporphase reflow/IR reflow may explain our problem to obtain chips in quantities of 10. The chip will aquire the temperature of the solder. Presence of moisture inside the package could cause cracking of housing. So they get shipped in dry packs containing 250 chips. The distributor is paralyzed into no action fearing to break the drypack! This is a hypothesis of course, anybody has one better? j ----- Original Message ----- From: "J.C. Wren" <> To: <> Sent: Wednesday, February 11, 2004 10:37 PM Subject: Re: [lpc2100] Footprint for LPC > It's always entertaining to play "find the right footprint". The > IPC footprint that most closely matches this is IPC-563A. The > difference? Lands are 1.6mm x .3mm vs Philips 1.1mm x .285mm. The > width difference isn't very significant, but the length is rather > substantial. The typical IPC specs are for MMC or "Maximum Material > Condition", which is basically the large end of all dimensions. LMC > ("Least Material Condition") doesn't seem to be used much. > > Supposedly, IPC specs are based on real world manufacturing > feedback, and take into account all the little details that relate to > making a product manufacturable. That being said, I am/was using the > IPC-563A footprint. I'd be interested in hearing the results of people > who have had boards made using vapor phase or IR reflow and what pad > dimensions they use. > > This has always been a pet peeve of mine. Some manufactures > reference IPC standards, some JEDEC, some have thier own, and some it's > just best guess. Given the choice, I'd prefer they adhered to IPC or > JEDEC, AND published the spec in the datasheet. National is really good > about this. Others are not. Referencing the IPC spec is great, but if > you can't afford to spring for the book, you're hosed. Luckily, I found > a copy on the web (< http://tinymicros.com/ipc >) from 1999, which has > most everything, but does lack TSSOP specs. > > --jc > > Joseph Tapay wrote: > > > or make your own library entry from official philips footprint drawing > > as i > > am doing it > > for LQFP48 package > > http://www.semiconductors.philips.com/acrobat/packages/footprint/FOOTPRINT-HTQFP-HLQFP-LQFP-REFLOW.pdf > > > > (i could not find the footprint for HVQFN48 package...) > > > > joseph |
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No, that's entirely correct. One solution is to bake the parts. We've had to do this a number of times where we use sealed packs for an initial build, then build from the same stock several months later. Our manufacturing company doesn't have climate controlled storage, so ICs and a few parts get baked as a precaution. I think they use something like 125F for 4 or 8 hours. I've seen the ovens, but I don't remember the temperature profiles. From what I understand, the most common failure mode is the bond wire from the die to the pin breaking. I've never seen external physical evidence of cracking, at least, not with the microscopes I've had at my disposal. I would imagine that most of the damage should occur internally, where the moisture expands before it can out-gas. Near the edge of the package, it would escape before it could expand far enough to leave evidence around the pins. It would be neat to see some photo-micrographs of parts known to be damaged this way. Other than parts being misregistered, installed backwards, or boards that sustained mechanical damage (like getting caught in a misadjusted feed chain...) I've never seen a chip that I've known to be damaged in manufacturing, i.e., from static or humidity issues. However, manufacturing is not my regular job, so I'm only around the manufacturing lines a couple times a year, and usually fine-tuning the test jigs. Most of my exposure to the rest of the process is providing feedback to the manufacturing manager when I find boards with consistent sets of problems. Since we don't run boards in huge quantities, we don't get the advantage of getting a line setup and tuned and cranking out thousands of flawless boards. We typically run 100 to 500 at a time, and it usually takes 50 boards or so to get all the placements right and the temperature profiles set. We also use a board house that does small runs, which means we get human inspection, and these people are far from flawless. --jc Joseph Tapay wrote: > excellent resource, thanks JC > i've noticed the shortness of the philips' solder land, so far no > rationale > to justify it... > philips' drawing shows two different width for start/end of row/column > (0.30mm) and in between (0.23mm) for LQFP64 package, which is relevant to > this group, IPC 565A landing pattern (IPC parlance versus philips > "footprint") does not differentiate, hmmm... interesting... > > The solder vaporphase reflow/IR reflow may explain our problem to obtain > chips in quantities of 10. The chip will aquire the temperature of the > solder. Presence of moisture inside the package could cause cracking of > housing. So they get shipped in dry packs containing 250 chips. The > distributor is paralyzed into no action fearing to break the drypack! > This is a hypothesis of course, anybody has one better? > > j |
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Hello, Dos anyone know a good FREE rtos with small footprint, that would be apropriate for LPC2106? /Pero |
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I think Michael has released his small-footprint RTOS in CrossWorks in the latest versions. -- Paul. -----Original Message----- From: Peter Kuhar [mailto:] Sent: 12 February 2004 18:51 To: Subject: [lpc2100] RTOS for LPC2106 Hello, Dos anyone know a good FREE rtos with small footprint, that would be apropriate for LPC2106? /Pero Yahoo! Groups Links |
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Try Micrium.com You can get it off the
website.
I bought their MicroC/OS book also and find it
very informative.
regards
Martin
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Could you email me their rtos. On the website are only ports. Tnx, Pero Friday, February 13, 2004, 11:16:13 PM, si napisal: > Try Micrium.com You can get it off the > website. > > I bought their MicroC/OS book also and find > it very informative. > > regards > Martin > ----- Original Message ----- > From: Peter Kuhar > To: > Sent: Friday, February 13, 2004 7:50 > AM > Subject: [lpc2100] RTOS for LPC2106 > Hello, > Dos anyone know a good FREE rtos with small > footprint, that would be > apropriate for > LPC2106? > /Pero > Yahoo! Groups Links > To |
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No, he can't. You have to buy the book. It's not shareware, it's not GPL, and it's not very expensive. --jc Peter Kuhar wrote: > Could you email me their rtos. On the website are only ports. > > Tnx, > Pero > Friday, February 13, 2004, 11:16:13 PM, si napisal: > > Try Micrium.com You can get it off the > > website. > > > > > > I bought their MicroC/OS book also and find > > it very informative. > > > > > > regards > > > Martin > > > ----- Original Message ----- > > > From: Peter Kuhar > > > To: > > > Sent: Friday, February 13, 2004 7:50 > > AM > > > Subject: [lpc2100] RTOS for LPC2106 > > > > Hello, > > > Dos anyone know a good FREE rtos with small > > footprint, that would be > > apropriate for > > LPC2106? > > > /Pero |
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Unfortunately I cannot email you the RTOS as it
is licensed as part of the book as that is how it originated but I can assure you at
$60-$70 US it was one of my best buys ever. Have a look at Amazon.com for it.
This book is quality throughout!!
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* martin de lange <>: > Try Micrium.com You can get it off the website. > > I bought their MicroC/OS book also and find it very informative. There is also a port of eCos to the 2106. It's not currently available on the eCos website yet but one can get it through the eCos bugzilla server. I am about to put it to use, stabilizing it if need be. If anyone is interested I'd be glad to share experiences. |
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I'm interested to run eCos on LPC2106 but my eCos footprint must fit in LPC internal memory, and I don't if it's possible ... If it could be possible, I suppose I must take current tree of eCos and patch it with the submited patch on bugzilla server. Benjamin -----Message d'origine----- De : Jean-Rene David [mailto:] Envoyé : mardi 17 février 2004 03:16 À : Objet : Re: [lpc2100] RTOS for LPC2106 * martin de lange <>: > Try Micrium.com You can get it off the website. > > I bought their MicroC/OS book also and find it very informative. There is also a port of eCos to the 2106. It's not currently available on the eCos website yet but one can get it through the eCos bugzilla server. I am about to put it to use, stabilizing it if need be. If anyone is interested I'd be glad to share experiences. ------------------------ Yahoo! Groups Sponsor ---------------------~--> Buy Ink Cartridges or Refill Kits for your HP, Epson, Canon or Lexmark Printer at MyInks.com. Free s/h on orders $50 or more to the US & Canada. http://www.c1tracking.com/l.asp?cid=5511 http://us.click.yahoo.com/mOAaAA/3exGAA/qnsNAA/dN_tlB/TM ---------------------------------------------------------------------~- Yahoo! Groups Links |
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Hi
Jean-Rene,
I'm certainly interested
in your experiences, hence, I'd appreciate if you could post them to this group. We will
shortly be looking at this as well. The existing port appears to have been done to our
EVBA7 board, however, since its all on-chip it should be easily adaptable to any other
LPC2000 based hardware.
Hugh @ http://www.ashling.com/support/lpc2100/
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On Mon, 16 Feb 2004 21:15:33 -0500, Jean-Rene David wrote: * martin de lange <>: > Try Micrium.com You can get it off the website. > > I bought their MicroC/OS book also and find it very informative. There is also a port of eCos to the 2106. It's not currently available on the eCos website yet but one can get it through the eCos bugzilla server. I am about to put it to use, stabilizing it if need be. If anyone is interested I'd be glad to share experiences. ======================================================= Yes, I'm interested. I'm just bringing up an LPC2214 board with external SRAM, a 10BaseT ethernet controller, and a CompactFlash connector. eCos was one option I have been considering as a software baseline. -Bill Knight R O SoftWare |
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Great
to see all the interest in eCOS on the LPC2000 (btw, LPC2000 is the new "official" family
name from Philips).
I can
recommend the following eCOS references:
Anthony
Massa' s book "Embedded Software Development with eCOS". It's worth buying a hardcopy,
however, a PDF version is available at:
http://www.informit.com/content/downloads/perens/0130354732.pdf
Anthony's homepage for the book is at:
http://authors.phptr.com/massa/
Other
useful eCOS online references are:
http://www.ecoscentric.com/index.shtml
http://sources.redhat.com/ecos/
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----- Original Message ----- From: "Hugh O'Keeffe" <> To: <> Sent: Tuesday, February 17, 2004 2:16 PM Subject: [lpc2100] re eCOS > Great to see all the interest in eCOS on the LPC2000 (btw, LPC2000 is > the new "official" family name from Philips). Perhaps I should rename the group. 8-) Leon -- Leon Heller, G1HSM Email: My low-cost Philips LPC210x ARM development system: http://www.geocities.com/leon_heller/lpc2104.html |
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On Tue, 17 Feb 2004, Leon Heller wrote: > > Great to see all the interest in eCOS on the LPC2000 (btw, LPC2000 is > > the new "official" family name from Philips). > > Perhaps I should rename the group. 8-) I'm now glad I called the Wiki "ARMuC" rather than "LPC21xx" - although I did make a page for the LPC21xx on there, and am thus having to make a seperate LPC22xx page - oh well! > Leon ABS -- Alaric B. Snell http://www.alaric-snell.com/ http://RFC.net/ http://www.warhead.org.uk/ Any sufficiently advanced technology can be emulated in software |