> Hi Tim,
>
> On 4/15/2012 10:37 PM, Tim Wescott wrote:
>> On Sun, 15 Apr 2012 21:52:07 -0500, john11w wrote:
>>
>>> I've developed a nice business over the past 15 years lately using the
>>> 89lpc92x family of parts. The DIP (20) package is important so that
>>> upgrades may be made in the field. Yearly volume is 3-5K parts. Yes,
>>> boards are assembled by hand using through hole parts. I support 5
>>> part timers and still use 51 assembler. About 15 active designs.
>>>
>>> I just blew the bondout R1.0 in my 2nd PDS900 and now have 1 left.
>>>
>>> The reality of my dependance on the on the PDS900 is hitting home.
>>>
>>> Does anyone have the hex for the bondout? Or an old PDS900
>>>
>>> If I must switch suppliers, any comments of mpu's in DIP and emulator
>>> support for those products. I see stuff from Silicon Labs and Infineon
>>> but no DIP parts.
>>
>> Make a plug-in board. There's plenty of board-board interconnect
>> solutions; just make a board with a processor, and away you go.
>
> It's a *bondout* processor. *Not* a (normal) COTS product. Having the
> *particular* (special) processor is the issue, here.
>
> (No idea how the OP has "blown" it...?)
"If I must switch suppliers, yadda yadda".
--
Tim Wescott
Control system and signal processing consulting
www.wescottdesign.com
Reply by Don Y●April 16, 20122012-04-16
Hi Tim,
On 4/15/2012 10:37 PM, Tim Wescott wrote:
> On Sun, 15 Apr 2012 21:52:07 -0500, john11w wrote:
>
>> I've developed a nice business over the past 15 years lately using the
>> 89lpc92x family of parts. The DIP (20) package is important so that
>> upgrades may be made in the field. Yearly volume is 3-5K parts. Yes,
>> boards are assembled by hand using through hole parts. I support 5 part
>> timers and still use 51 assembler. About 15 active designs.
>>
>> I just blew the bondout R1.0 in my 2nd PDS900 and now have 1 left.
>>
>> The reality of my dependance on the on the PDS900 is hitting home.
>>
>> Does anyone have the hex for the bondout? Or an old PDS900
>>
>> If I must switch suppliers, any comments of mpu's in DIP and emulator
>> support for those products. I see stuff from Silicon Labs and Infineon
>> but no DIP parts.
>
> Make a plug-in board. There's plenty of board-board interconnect
> solutions; just make a board with a processor, and away you go.
It's a *bondout* processor. *Not* a (normal) COTS product. Having
the *particular* (special) processor is the issue, here.
(No idea how the OP has "blown" it...?)
Reply by Tim Wescott●April 16, 20122012-04-16
On Sun, 15 Apr 2012 21:52:07 -0500, john11w wrote:
> I've developed a nice business over the past 15 years lately using the
> 89lpc92x family of parts. The DIP (20) package is important so that
> upgrades may be made in the field. Yearly volume is 3-5K parts. Yes,
> boards are assembled by hand using through hole parts. I support 5 part
> timers and still use 51 assembler. About 15 active designs.
>
> I just blew the bondout R1.0 in my 2nd PDS900 and now have 1 left.
>
> The reality of my dependance on the on the PDS900 is hitting home.
>
> Does anyone have the hex for the bondout? Or an old PDS900
>
> If I must switch suppliers, any comments of mpu's in DIP and emulator
> support for those products. I see stuff from Silicon Labs and Infineon
> but no DIP parts.
Make a plug-in board. There's plenty of board-board interconnect
solutions; just make a board with a processor, and away you go.
--
Tim Wescott
Control system and signal processing consulting
www.wescottdesign.com
Reply by john11w●April 15, 20122012-04-15
I've developed a nice business over the past 15 years lately using the
89lpc92x family of parts. The DIP (20) package is important so that
upgrades may be made in the field. Yearly volume is 3-5K parts. Yes, boards
are assembled by hand using through hole parts. I support 5 part timers and
still use 51 assembler. About 15 active designs.
I just blew the bondout R1.0 in my 2nd PDS900 and now have 1 left.
The reality of my dependance on the on the PDS900 is hitting home.
Does anyone have the hex for the bondout? Or an old PDS900
If I must switch suppliers, any comments of mpu's in DIP and emulator
support for those products. I see stuff from Silicon Labs and Infineon but
no DIP parts.
Many thanks
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