MPF200TC in Microchip PolarFire Family
The MPF200TC sub-family, part of the Microchip Technology PolarFire FPGA series, is engineered to provide mid-range density with industry-leading power efficiency and security. These FPGAs feature 192,000 logic elements and are designed for applications requiring high-speed serial connectivity and significant computational throughput without the thermal overhead typical of SRAM-based architectures. By utilizing non-volatile flash-based configuration, the MPF200TC offers instant-on capability and high immunity to single-event upsets, making it ideal for robust industrial and communications infrastructure.
Variants in This Sub-Family
Variants within the MPF200TC sub-family primarily differ based on package type, pin count, and operating temperature grades. Engineers can select between Fine Pitch Ball Grid Array (FCG) packages with different dimensions, such as the FCG484 or FCG784, to match PCB density requirements. Additionally, devices are offered in Extended Commercial (0C to 100C) and Industrial (-40C to 100C) temperature ranges to suit varied deployment environments.
