W25N04KWZEIR in Winbond W25Q SPI NOR Flash Family
The W25N04KWZEIR is a high-density member of the Winbond QspiNAND Flash family, specifically a 4Gbit Single-Level Cell (SLC) NAND device. It bridges the gap between traditional SPI NOR Flash and parallel NAND by offering a serialized interface that reduces pin count while maintaining the reliability and endurance of SLC architecture. Produced by Winbond Electronics, these components are engineered for high-performance embedded systems requiring robust non-volatile storage with integrated error correction and high throughput.
Variants in This Sub-Family
Variants within this sub-family are generally distinguished by their packaging options and temperature ratings. While the W25N04KWZEIR utilizes an 8-pad WSON package, other versions may offer TFBGA24 for broader PCB layout flexibility. Additionally, parts are categorized by industrial temperature ranges (-40°C to +85°C) versus extended or automotive-grade specifications, ensuring compatibility with diverse environmental operating requirements while maintaining the core 4Gb 104MHz SPI-Quad I/O specifications.
