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TE Connectivity 1513164-1 Dual-Band Antenna

TE Connectivity 1513164-1 Dual-Band Antenna

MPN: 1513164-1
TE Connectivity AMP Connectors
RF ANTENNA Bluetooth, WLAN, Zigbee™ Molded Solder Surface Mount
Active3,082 in stock

Overview

The 1513164-1 is a surface-mount, dual-band molded antenna designed for high-performance wireless connectivity in the 2.4GHz and 5GHz frequency ranges. It supports a wide array of protocols including Bluetooth, Wi-Fi, and Zigbee, making it a versatile solution for compact RF designs. Its small 16mm x 6mm footprint allows for integration into space-constrained mobile or embedded devices.

Why Choose This Part

This antenna offers a high gain of 4dBi and a VSWR of 2.5, ensuring efficient signal transmission across both bands. Its surface-mount design and solder termination simplify high-volume automated assembly while maintaining a robust mechanical connection. The wide operating temperature range of -40C to +85C makes it suitable for demanding environmental conditions.

Applications

Dual-Band Wi-Fi Routers
Provides reliable 2.4GHz and 5.5GHz connectivity for compact networking hardware and access points.
Industrial IoT Gateways
Enables long-range Zigbee or Bluetooth communication for sensor mesh networks in industrial environments.
Smart Home Appliances
Integrates into smart home devices requiring simultaneous support for high-bandwidth Wi-Fi and low-power Bluetooth control.
Wearable Electronics
Fits into small enclosures for health monitors or fitness trackers needing robust wireless links.

Key Specifications

Gain 4dBi
VSWR 2.5
Power - Max 10 W
Termination Solder
Antenna Type Molded
Applications Bluetooth, WLAN, Zigbee
Height (Max) 0.236" (6.00mm)
Mounting Type Surface Mount
Frequency Group UHF (2GHz ~ 3GHz), SHF (f > 4GHz)
Frequency Range 2.4GHz ~ 2.483.5GHz, 5.15GHz ~ 5.875GHz
Number of Bands 2
RF Family/Standard 802.15.4, Bluetooth, WiFi
Frequency (Center/Band) 2.4GHz, 5.5GHz

Getting Started

When integrating this antenna, ensure the PCB layout follows the manufacturer's recommended ground plane clearances to achieve the rated 4dBi gain. Engineers should perform impedance matching with a network analyzer to tune the VSWR for the specific enclosure material and board stack-up. Solid solder fillets are required for the surface-mount pads to ensure mechanical stability and RF performance.

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