EmbeddedRelated.com
The 2026 Embedded Online Conference
AMP-LATCH Novo 20-Position IDC Receptacle

AMP-LATCH Novo 20-Position IDC Receptacle

MPN: 1658621-4
TE Connectivity AMP Connectors
20 Position Rectangular Receptacle Connector IDC Gold or Gold-Palladium 26-28 AWG
Active3,259 in stock

Overview

The 1658621-4 is a 20-position rectangular receptacle from the TE Connectivity AMP-LATCH Novo series designed for efficient wire-to-board connections. It utilizes Insulation Displacement Contact (IDC) technology to terminate 26-28 AWG ribbon cable without the need for stripping individual conductors. The connector features a 0.100 inch (2.54mm) pitch and includes a polarizing key to ensure correct mating orientation.

Why Choose This Part

The dual-beam forked contact design provides high reliability and redundant electrical paths at each contact point. Gold or gold-palladium plating over phosphor-bronze ensures excellent corrosion resistance and signal integrity over the life of the product. The feed-through design and integrated polarizing key simplify high-volume assembly and prevent field service errors.

Applications

Internal Signal Routing
Connecting motherboards to peripheral daughtercards or front panel interfaces using multi-conductor ribbon cables.
Industrial Control Panels
Linking PLC modules to localized HMI units or sensor arrays in high-density rack systems.
Prototyping and Debugging
Creating custom breakout cables for 20-pin JTAG/SWD headers often found on ARM-based development platforms.

Key Specifications

Color Black
Pitch 0.100" (2.54mm)
Features Feed Through, Polarizing Key
Wire Type Ribbon Cable
Wire Gauge 26-28 AWG
Row Spacing 0.100" (2.54mm)
Contact Type Forked
Mounting Type Free Hanging (In-Line)
Connector Type Receptacle
Contact Finish Gold or Gold-Palladium
Number of Rows 2
Cable Termination IDC
Number of Positions 20
Contact Finish Thickness 15.0uin (0.38um)

Also Consider

1658621-1 TE Connectivity - A 10-position variant from the same AMP-LATCH Novo series if a smaller pin count is required for the application.
The 2026 Embedded Online Conference