HPI Socket Contact 24-30 AWG Tin
Overview
The 1735801-1 is a crimp socket contact from the TE Connectivity HPI (High Performance Interconnect) series, designed for wire-to-board applications. It accepts a wire gauge range of 24 to 30 AWG and features a tin-plated finish for cost-effective conductivity. This contact is engineered for use in high-density electronic assemblies requiring reliable signal transmission.
Why Choose This Part
The wide wire gauge range of 24-30 AWG provides flexibility for designers to use different wire thicknesses depending on current requirements. Its tin plating offers a balance of durability and affordability for standard environment applications. The HPI series design ensures consistent crimp performance and easy insertion into compatible housing shells.



