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74LVC2T45DC-Q100H

74LVC2T45DC-Q100H

Nexperia USA Inc.
Voltage Level Translator Bidirectional 1 Circuit 2 Channel 420Mbps 8-VSSOP
Active35,640 in stock

Overview

The 74LVC2T45DC-Q100H is an automotive-qualified (AEC-Q100) dual-bit, dual-supply voltage level translator designed for bidirectional communication between different logic voltage domains. It supports a wide range of supply voltages from 1.2V to 5.5V on both ports, enabling seamless interfacing between legacy 5V systems and modern low-voltage microcontrollers. The device features high-speed performance up to 420Mbps and high-impedance outputs when either supply is at ground.

Why Choose This Part

This translator features 420Mbps throughput and 24mA drive capability, making it suitable for high-speed data buses. It includes specialized Ioff circuitry for partial power-down modes and robust ESD protection exceeding 4000V HBM for automotive reliability. The dual-supply architecture allows VCCA and VCCB to be independent, providing maximum flexibility in multi-voltage system designs.

Applications

Automotive Sensor Interfacing
Translating logic levels between 5V automotive sensors and 1.8V or 3.3V ADAS processing units.
High-Speed Communication Buffering
Providing bidirectional level shifting for high-speed digital interfaces like SPI or UART in harsh EMI environments.
Power-Down Isolation
Utilizing the Ioff circuitry to prevent backflow current when one power rail is powered down in battery-sensitive modules.

Key Specifications

Data Rate 420Mbps
Output Type Tri-State, Non-Inverted
Channel Type Bidirectional
Mounting Type Surface Mount
Package / Case 8-VFSOP (0.091", 2.30mm Width)
Voltage - VCCA 1.2 V ~ 5.5 V
Voltage - VCCB 1.2 V ~ 5.5 V
Translator Type Voltage Level
Number of Circuits 1
Channels per Circuit 2
Operating Temperature -40degC ~ 125degC (TA)
Supplier Device Package 8-VSSOP

Getting Started

Ensure that the DIR pin is tied to either VCCA or GND to set the data direction, and provide decoupling capacitors for both VCCA and VCCB rails. For evaluation, use a VSSOP8-to-DIP breakout board to integrate the device into a breadboard prototype for logic verification. Refer to the AEC-Q100 documentation for thermal and vibration considerations in automotive deployments.