77311-118-08LF
Amphenol FCI
Headers & Wire Housings 8P STR SR TMT HDR .76 AU .45IN LENGTH
251 in stock
Overview
The 77311-118-08LF is an 8-position, single-row BergStik header from Amphenol FCI featuring a standard 2.54mm (0.100 inch) pitch. This unshrouded vertical header uses through-hole mounting and phosphor-bronze pins with gold plating on the contact area for reliable electrical performance. It is designed for board-to-board or wire-to-board connections in a wide variety of electronic assemblies.
Why Choose This Part
The BergStik series is recognized for its high-temperature thermoplastic housing which withstands standard soldering processes. The 0.38 micron gold plating ensures low contact resistance and durability for up to 100 mating cycles. Its square pin design provides a secure mechanical fit in standard 0.1 inch female sockets or crimp housings.
Applications
Board-to-Board Interconnects
Used as a vertical male header to stack PCBs or connect daughter cards to a main motherboard.
Microcontroller Breakouts
Providing external I/O access for 8-pin peripheral modules or sensor boards.
Internal Jumpers and Configuration
Acting as a pin block for manual configuration via shorting jumpers or shunt connectors.
Key Specifications
Style
Board to Board
Shrouding
Unshrouded
Termination
Solder
Contact Type
Male Pin
Contact Shape
Square
Mounting Type
Through Hole
Connector Type
Header
Fastening Type
Push-Pull
Number of Rows
1
Pitch - Mating
0.100" (2.54mm)
Contact Material
Phosphor Bronze
Insulation Color
Black
Insulation Height
0.100" (2.54mm)
Insulation Material
Thermoplastic
Number of Positions
8
Contact Finish - Post
Tin
Contact Length - Post
0.120" (3.05mm)
Current Rating (Amps)
3A per Contact
Operating Temperature
-65degC ~ 125degC
Overall Contact Length
0.450" (11.43mm)
Contact Finish - Mating
Gold or Gold, GXT
Contact Length - Mating
0.230" (5.84mm)
Number of Positions Loaded
All
Material Flammability Rating
UL94 V-0
Contact Finish Thickness - Mating
30.0uin (0.76um)
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