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ABM3B-8.000MHZ-B2-T

ABM3B-8.000MHZ-B2-T

Abracon LLC
8 MHz ±20ppm Crystal 18pF 200 Ohms 4-SMD, No Lead
Active93,259 in stock
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Overview

The ABM3B-8.000MHZ-B2-T is a low-profile surface-mount quartz crystal designed for precision frequency control. It operates at 8.000 MHz with a tight frequency tolerance of +/-20ppm and is housed in a compact 5.0 x 3.2 mm ceramic package. This component is optimized for applications requiring a stable clock source with a standard 18pF load capacitance and an ESR of 200 Ohms.

Why Choose This Part

This crystal features a ultra-miniature 1.1mm maximum height, making it ideal for high-density PCB layouts. Its AT-cut design ensures high stability and reliability over its specified operating temperature range. The 5.0 x 3.2 mm footprint is an industry-standard size, ensuring compatibility with common pick-and-place processes.

Applications

Microcontroller Clocking
Provides the primary system clock for 8-bit and 16-bit MCUs requiring a stable 8 MHz timebase.
Real-Time Clocks
Acts as a frequency reference for RTC circuits and timing peripherals in embedded systems.
Communication Interfaces
Serves as a local oscillator for serial communication protocols that require better accuracy than internal RC oscillators.
Industrial Control Systems
Reliable timing source for PLCs and industrial sensors operating within the -20C to +70C temperature range.

Key Specifications

Type MHz Crystal
Frequency 8 MHz
Mounting Type Surface Mount
Operating Mode Fundamental
Package / Case 4-SMD, No Lead
Load Capacitance 18pF
Size / Dimension 0.197" L x 0.126" W (5.00mm x 3.20mm)
Frequency Stability +/-50ppm
Frequency Tolerance +/-20ppm
Height - Seated (Max) 0.043" (1.10mm)
Operating Temperature -20degC ~ 70degC
Supplier Device Package 4-SMD (5x3.2)
ESR (Equivalent Series Resistance) 200 Ohms

Getting Started

When integrating this crystal, ensure the load capacitors (C1 and C2) are calculated based on the 18pF specification plus stray PCB capacitance. Place the crystal as close to the MCU oscillator pins as possible to minimize EMI and trace inductance. Avoid running high-speed digital traces directly underneath the crystal unit to prevent noise coupling.