ASFC32G31T3-51BIN
Overview
The ASFC32G31T3-51BIN is a 32GB (256Gbit) eMMC 5.1 managed NAND flash memory solution based on 3D TLC technology. It integrates a dedicated controller to handle complex flash management tasks such as error correction (ECC), wear leveling, and bad block management within a single 153-ball FBGA package. Operating at up to 200 MHz in HS400 DDR mode, it provides a high-speed storage interface for embedded systems requiring high-density non-volatile memory.
Why Choose This Part
The eMMC 5.1 interface simplifies system design by abstracting NAND flash complexities, while features like Power-fail data loss protection and Device Health Reports enhance long-term system reliability. It offers high-speed performance with read currents of 141mA (Vcco 1.8V) and write currents of 89mA (Vcco 1.8V) during 200MHz DDR operation. The 153-FBGA package with 0.5mm pitch provides a compact footprint suitable for space-constrained PCB layouts.
Applications
Getting Started
To integrate this device, ensure your host processor supports the JEDEC JESD84-B51 eMMC 5.1 standard and provides dual voltage rails for Vcc (3.3V) and Vccq (1.8V or 3.3V). Engineers should implement firmware support for RPMB (Replay Protected Memory Block) and Field Firmware Updates to maintain security and reliability in the field. Review the 153-ball BGA footprint requirements, specifically the 0.5mm pitch, for appropriate PCB manufacturing tolerances.
