ASP-134603-01 Mezzanine Socket
MPN: ASP-134603-01
Samtec
Board to Board & Mezzanine Connectors ASP
1,101 in stock
Overview
The ASP-134603-01 is a high-density, 40-position board-to-board socket array from Samtec, featuring a 1.27mm (0.050 inch) pitch. Part of a specialized series often associated with high-speed mezzanine applications, this surface-mount connector provides a reliable interface for stacking PCBs in space-constrained designs. Its liquid crystal polymer (LCP) housing is rated UL 94 V0, ensuring durability and compliance with industrial flame retardancy standards.
Why Choose This Part
The 1.27mm pitch offers a balance between high signal density and manageable SMT assembly tolerances. The use of LCP housing allows for high-temperature reflow soldering, while the 40-position array supports significant I/O throughput in a compact footprint.
Applications
FPGA Mezzanine Cards
Connecting daughter cards to carrier boards in high-speed digital processing systems.
Embedded Computing Modules
Providing a reliable interface for System-on-Module (SoM) to baseboard connectivity.
Industrial Control Systems
Stacking parallel PCBs within ruggedized enclosures for automation hardware.
Telecommunications Hardware
High-density signal routing in networking switches and line cards.
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