ASP-184330-01
Samtec Inc.
Position Connector High Density Array, Male Surface Mount Gold
Active2,673 in stock
Overview
The ASP-184330-01 is a high-density SEAM series male connector from Samtec featuring a 0.050 inch (1.27mm) pitch and a 14-row array configuration. Designed for high-speed mezzanine applications, this surface-mount component includes integrated board guides to ensure precise alignment during mating. With a 30 microinch gold contact finish, it is engineered for high-reliability signal integrity in complex multi-board systems.
Why Choose This Part
This connector supports flexible stacking heights ranging from 8.5mm to 11.5mm when mated with various female SEAF series connectors. The high-density 14-row layout maximizes I/O per square inch of PCB real estate while the 30 microinch gold plating ensures low contact resistance over long-term operation.
Applications
FPGA Mezzanine Cards
High-pin-count interconnects for daughtercards requiring high-speed differential signal routing.
High-Bandwidth Networking
Board-to-board connections in routers and switches where signal density is critical.
Backplane Interconnects
Reliable high-density vertical stacking for modular embedded computing systems.
Data Acquisition Systems
Connecting multi-channel sensor interface boards to central processing units.
Key Specifications
Pitch
0.050" (1.27mm)
Features
Board Guide
Mounting Type
Surface Mount
Connector Type
High Density Array, Male
Contact Finish
Gold
Number of Rows
14
Height Above Board
0.240" (6.10mm)
Mated Stacking Heights
8.5mm, 9.5mm, 10mm, 11mm, 11.5mm
Contact Finish Thickness
30.0uin (0.76um)
