BB1660 Solderless Breadboard
Overview
The BB1660 by BusBoard Prototype Systems is a large-format solderless breadboard designed for complex circuit prototyping. It features 1660 tie-points and is mounted on a rugged metal backing plate to provide mechanical stability and electrical shielding during development.
Why Choose This Part
The inclusion of a heavy-duty metal backing plate prevents board flexing and provides four integrated binding posts for easy connection to bench power supplies. With 1660 tie-points, it offers significantly more workspace than standard 830-point boards while maintaining a standard 0.1 inch hole spacing for DIP components.
Applications
Getting Started
To use the BB1660, peel the adhesive backing off the breadboard modules and secure them to the metal plate if not pre-assembled. Use standard 22 AWG solid core wire or pre-formed jumper wires for reliable connections. The four binding posts should be wired to the distribution rails using the provided hardware to simplify benchtop power integration.



