BB830 Solderless Breadboard
Overview
The BB830 is a high-quality solderless plug-in breadboard featuring 830 tie-points, including two power rails and a standard 630 tie-point IC area. It is designed for rapid prototyping of electronic circuits without the need for soldering, utilizing a 0.1 inch hole pitch compatible with standard DIP packages and headers.
Why Choose This Part
The BB830 features a heavy-duty adhesive backing for mounting to work surfaces and interlocking tabs that allow multiple units to be connected for larger projects. Its internal phosphor bronze contacts are rated for high insertion cycles, ensuring reliable electrical connections over time.
Applications
Getting Started
To use the BB830, simply plug in standard 22 AWG solid-core wire or pre-formed jumper wires into the tie-points. Components should be oriented across the center divider to prevent shorting IC pins, and power should be applied to the longitudinal outer rails.
