EmbeddedRelated.com
The 2026 Embedded Online Conference
    Parts    BG95M2LA-64-SGNS*IOT
BG95M2LA-64-SGNS*IOT

BG95M2LA-64-SGNS*IOT

Quectel
Cellular, Navigation BeiDou, Galileo, GLONASS, GNSS, GPRS, GPS, LTE, QZSS Transceiver Module Antenna Not Included Surface Mount
Active
Datasheet Digi-Key Compare Prices

Overview

The BG95M2LA-64-SGNS*IOT is a multi-mode LPWA module from Quectel supporting LTE Cat M1, Cat NB2, and EGPRS with integrated GNSS. It is built on an ARM Cortex A7 architecture and features ultra-low power consumption, making it ideal for battery-operated IoT devices that require both cellular connectivity and precise positioning across multiple satellite constellations including GPS, GLONASS, and Galileo.

Why Choose This Part

This module offers exceptional power efficiency with a sleep current of approximately 1.68 uA and a wide operating voltage range from 2.6V to 4.8V. Its integrated RAM and flash, along with support for eSIM and hardware-based security, reduce the overall bill of materials and board space for complex IoT designs.

Applications

Asset Tracking
Utilizes multi-constellation GNSS and LTE connectivity to monitor the location and status of cargo and shipping containers globally.
Smart Metering
Enables long-range reporting for utility meters in challenging environments using NB-IoT or Cat M1 with deep penetration capabilities.
Wearable Devices
The ultra-low sleep current and small LGA form factor allow for integration into compact health and fitness trackers.
Industrial Monitoring
Provides reliable data links for remote sensors in oil, gas, and agriculture using energy-efficient eDRX and PSM modes.

Getting Started

Development typically involves the Quectel BG95 series EVB or the UMTS&LTE EVB kit paired with Quectel enhanced AT commands. Engineers can utilize the QuecOpen environment for embedded applications and manage firmware updates via DFOTA over the cellular link.

Also Consider

Quectel BG96 Quectel - A widely adopted predecessor offering similar Cat M1/NB1 support but with different power profiles and footprint considerations.
The 2026 Embedded Online Conference