EmbeddedRelated.com
BMI270

BMI270

Bosch Sensortec
Accelerometer, Gyroscope, 6 Axis Sensor I2C, SPI Output
Active79,535 in stock

Overview

The BMI270 is an ultra-low power 6-axis Inertial Measurement Unit (IMU) designed specifically for wearable and mobile applications. It combines a 16-bit triaxial gyroscope and a 16-bit triaxial accelerometer in a compact 2.5 x 3.0 mm LGA package. The sensor features a built-in power management unit and ultra-low current consumption, typically 0.685mA in normal mode for both accelerometer and gyroscope.

Why Choose This Part

The BMI270 stands out for its ultra-low power architecture, featuring a dedicated on-chip FIFO buffer and an integrated power management unit that reduces host processor overhead. It includes specialized features like Component Re-Trimming (CRT) for fast sensitivity error compensation and hardware synchronization of inertial and auxiliary sensors.

Applications

Wearable Devices
Optimized for smartwatches and fitness trackers requiring precise step counting, gesture recognition, and tilt detection.
Augmented and Virtual Reality
High-performance gyroscope mode with 0.9mA current draw provides low-latency head tracking for AR/VR headsets.
IoT Motion Sensing
Ideal for battery-powered smart home devices that require motion-triggered wake-up or orientation detection.
Industrial Handhelds
Robust motion sensing for portable industrial tools requiring impact detection and vibration monitoring across -40C to 85C.

Key Specifications

Output Type I2C, SPI
Sensor Type Accelerometer, Gyroscope, 6 Axis
Mounting Type Surface Mount
Package / Case 14-VFLGA
Operating Temperature -40degC ~ 85degC
Supplier Device Package 14-LGA (2.5x3)

Getting Started

Engineers can evaluate the BMI270 using the Bosch Sensortec Application Board 3.0 or the BMI270 Shuttle Board. Integration is supported by the Bosch Sensortec sensor API available on GitHub, which provides C drivers for I2C and SPI communication. Ensure the 14-VFLGA package is handled according to moisture sensitivity level 1 standards during assembly.

Also Consider

LSM6DSOX STMicroelectronics - Features an embedded Finite State Machine and Machine Learning Core to further reduce host MCU power consumption.
ICM-42605 TDK InvenSense - Offers a similar 6-axis integrated solution with high-resolution output and low noise for precise motion tracking.