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Bridgelux Vero 10 Gen 7 LED Array

Bridgelux Vero 10 Gen 7 LED Array

MPN: BXRC-30E1000-B-73
Bridgelux
LED Lighting COBs Engines Modules Chip On Board (COB) Gen 7 Vero® 10 Array White, Warm Starboard
Active465 in stock

Overview

The BXRC-30E1000-B-73 is a high-performance Chip-on-Board (COB) LED module from the Bridgelux Vero 10 Gen 7 series. This warm white LED delivers approximately 1000 lumens at 3000K CCT with a 3-step MacAdam Ellipse for superior color consistency. It features an integrated connector port for solderless electrical connections and a radial die pattern for improved optical performance.

Why Choose This Part

This module features an on-board connector port for easier assembly and thermally isolated solder pads for flexible installation. The Gen 7 technology provides 3-step SDCM color control and a maximum current rating of 540mA, allowing for design overhead or high-output bursts.

Applications

Commercial Downlights
Ideal for recessed ceiling fixtures requiring high efficacy and tight color control in retail or office environments.
Hospitality Lighting
The 3000K warm white output and high CRI are suited for hotels, restaurants, and residential living spaces.
Track Lighting
Compact form factor and high lumen density allow for small-footprint spotlighting with excellent beam control.

Key Specifications

Type Chip On Board (COB)
Color White, Warm
Height 1.90mm
CCT (K) 3000K 3-Step MacAdam Ellipse
Features With Connector
Lens Type Flat
Configuration Starboard
Current - Max 540mA
Viewing Angle 120deg
Current - Test 270mA
Size / Dimension 20.00mm Dia
Temperature - Test 25degC
CRI (Color Rendering Index) 80
Light Emitting Surface (LES) 9.90mm Dia
Lumens/Watt @ Current - Test 155 lm/W
Voltage - Forward (Vf) (Typ) 34.8V
Luminous Flux @ Current/Temperature 1452lm (Typ)

Getting Started

To drive this COB, use a constant current LED driver rated for 270mA (nominal) with a forward voltage range between 32.2V and 37.4V. Ensure the module is mounted to a properly sized heat sink using thermal interface material to maintain the case temperature below 105C. Solderless connectivity can be achieved using compatible Molex or TE connectivity headers.