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CC2651R3SIPAT0MOUR

TICC2651R3SIPAT0MOUR

Texas Instruments
802.15.4, Bluetooth Bluetooth v5.2, EDGE, Wireless M-Bus, Zigbee® Transceiver Module 2.36GHz ~ 2.5GHz Integrated Trace Surface Mount
Active5,992 in stock

Overview

The CC2651R3SIPAT0MOUR is a certified System-in-Package (SiP) module from Texas Instruments that integrates a 48 MHz Arm Cortex-M4 microcontroller with a multi-protocol 2.4 GHz radio. It supports Bluetooth 5.2 Low Energy, Zigbee, and IEEE 802.15.4, featuring an integrated trace antenna and on-chip DC/DC converter for compact, low-power wireless designs.

Why Choose This Part

The SiP design simplifies RF layout by integrating the antenna and passive components into a 7x7 mm QFM package, significantly reducing PCB footprint and certification complexity. With a standby current of 0.8 uA and a high-performance Arm Cortex-M4 core, it provides a balanced platform for complex edge processing and extended battery life.

Applications

Smart Home Hubs
Utilizing multi-protocol support to bridge Zigbee and Bluetooth Low Energy devices within a unified ecosystem.
Industrial Sensors
Deploying long-range, low-power sensor nodes using the -104 dBm sensitivity and integrated hardware encryption for secure data transit.
Wireless M-Bus Metering
Implementing utility metering solutions that require 2.4 GHz Wireless M-Bus protocol compliance and ultra-low standby current.

Key Specifications

Protocol Bluetooth v5.2, EDGE, Wireless M-Bus, Zigbee
Data Rate 2Mbps
Frequency 2.36GHz ~ 2.5GHz
Modulation DSSS, FSK, GFSK, MSK, O-QPSK
Memory Size 352kB Flash, 32kB RAM
Sensitivity -104dBm
Antenna Type Integrated Trace
Mounting Type Surface Mount
Package / Case 59-SMD Module
Power - Output 5dBm
Voltage - Supply 1.8V ~ 3.8V
Serial Interfaces GPIO, I2C, I2S, JTAG, SPI, UART
RF Family/Standard 802.15.4, Bluetooth
Utilized IC / Part CC2651R3
Current - Receiving 6.8mA
Operating Temperature -40degC ~ 105degC (TA)
Current - Transmitting 7.1mA ~ 10mA

Getting Started

Development is supported by the SimpleLink CC26x1 SDK and TI Code Composer Studio. Engineers should utilize the LP-CC2651R3 LaunchPad development kit for initial prototyping and use the integrated JTAG or SWD interfaces for debugging and programming.

Also Consider

MGM210P Mighty Gecko Module SiLSilicon Labs - Offers a similar integrated multi-protocol solution with a focus on Zigbee, Thread, and Matter support.
CC2652R TITexas Instruments - A discrete IC alternative for designs where PCB space allows for external RF matching to reduce unit cost.
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