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CDC3RL02YFPR

TICDC3RL02YFPR

Texas Instruments
Clock Fanout Buffer (Distribution) IC 1:2 52 MHz 8-XFBGA, DSBGA
Active2,058 in stock

Overview

The CDC3RL02YFPR is a high-performance 1:2 clock fanout buffer designed to distribute a single LVCMOS clock input to two identical LVCMOS outputs. Operating at frequencies up to 52 MHz, it serves as a low-power clock distribution solution for mobile and space-constrained applications. The device supports a wide supply voltage range from 2.3V to 5.5V and features an ultra-low standby current of 0.2 uA.

Why Choose This Part

This buffer offers an extremely compact 8-DSBGA package (0.8mm x 1.6mm) with a 0.4mm pitch, making it ideal for high-density PCB layouts. Its low additive phase noise of -149 dBc/Hz and flexible 2.3V to 5.5V supply range allow it to integrate into diverse system architectures without compromising signal integrity.

Applications

Mobile Handsets
Distributing reference clocks to multiple baseband or application processors while maintaining a small footprint.
Portable Navigation Devices
Providing synchronized clock signals to GPS modules and peripheral controllers.
Low-Power Handhelds
Extending battery life in mobile devices through its 0.2 uA standby mode and low active current.

Key Specifications

Type Fanout Buffer (Distribution)
Input LVCMOS
Output LVCMOS
Mounting Type Surface Mount
Package / Case 8-XFBGA, DSBGA
Frequency - Max 52 MHz
Voltage - Supply 2.3V ~ 5.5V
Number of Circuits 1
Ratio - Input:Output 1:2
Operating Temperature -40degC ~ 85degC
Supplier Device Package 8-DSBGA
Differential - Input:Output No/No

Getting Started

When integrating the CDC3RL02YFPR, ensure that bypass capacitors are placed as close as possible to the VDD pin to minimize noise. Engineers should validate the 1.78 V/us slew rate against the requirements of downstream LVCMOS inputs to ensure clean switching. For prototyping, utilize a DSBGA breakout board or a specialized SMT adapter due to the fine 0.4mm ball pitch.

Also Consider

74LVC1G125 Nexperia - A simpler single-gate buffer alternative if 1:2 fanout is not required and a leaded package is preferred for easier soldering.