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DA14531-00000OG2

RENDA14531-00000OG2

Renesas Electronics Corporation
IC RF TxRx + MCU Bluetooth Bluetooth v5.1 2.4GHz 17-XFBGA, WLCSP
Active17,897 in stock

Overview

The DA14531-00000OG2, also known as the SmartBond TINY, is an ultra-low power Bluetooth 5.1 System-on-Chip (SoC) featuring an integrated Arm Cortex-M0+ processor. It is specifically designed to minimize system cost and power consumption, operating from supply voltages as low as 1.1V with a peak TX current of only 3.5 mA. This 17-pin WLCSP device includes an integrated buck/boost DCDC converter and 48kB of RAM for hosting complete BLE applications.

Why Choose This Part

This SoC stands out for its extreme power efficiency, consuming only 0.9 uA in extended sleep mode and supporting a wide supply range from 1.1V to 3.3V. Its integrated DCDC converter simplifies power management by allowing the system to run directly off small batteries without external regulators. The tiny WLCSP package reduces PCB area requirements significantly compared to traditional QFN alternatives.

Applications

Disposable Medical Sensors
Ideal for single-use medical patches and diagnostic devices due to its ultra-low cost and ability to run on silver oxide or alkaline batteries.
Smart Retail Tags
Used in Electronic Shelf Labels (ESL) and proximity beacons where multi-year battery life from a coin cell is mandatory.
Connected Wearables
Fits into space-constrained fitness trackers and smart jewelry thanks to its tiny 1.7mm x 2.05mm footprint.
Wireless PC Peripherals
Suited for low-latency wireless mice and keyboards using the 2.4GHz Bluetooth Low Energy protocol.

Key Specifications

GPIO 6
Type TxRx + MCU
Protocol Bluetooth v5.1
Frequency 2.4GHz
Memory Size 48kB RAM, 144kB ROM
Sensitivity -94dBm
Mounting Type Surface Mount
Package / Case 17-XFBGA, WLCSP
Power - Output 2.5dBm
Voltage - Supply 1.1V ~ 3.3V
Serial Interfaces ADC, GPIO, I2C, SPI, UART
RF Family/Standard Bluetooth
Current - Receiving 2.2mA
Operating Temperature -40degC ~ 85degC
Current - Transmitting 3.5mA
Supplier Device Package 17-WLCSP (2.032x1.694)

Getting Started

Begin development with the SmartBond TINY Development Kit-Pro to access all GPIOs and power measurement headers. Software development is supported through the Renesas SmartBond SDK and Keil MDK, which provide BLE stacks and example profiles. Use the SmartConsole mobile app for quick prototyping and OTA (Over-the-Air) firmware update testing.

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