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DF30FC-60DP-0.4V(82)

DF30FC-60DP-0.4V(82)

Hirose Connector
Board to Board & Mezzanine Connectors 60P DR HEADER W/O FITTING W/O BOSS
1,125 in stock

Overview

The DF30FC-60DP-0.4V(82) is a high-density, 60-position board-to-board header with a fine 0.40mm pitch designed for space-constrained electronics. It features a low-profile design with a mated stacking height of just 0.9mm and a vertical orientation for compact PCB layouts. This surface-mount connector utilizes phosphor bronze contacts with gold plating to ensure reliable signal integrity in miniature assemblies.

Why Choose This Part

The primary advantage is the ultra-low stacking height of 0.9mm, which significantly reduces the vertical footprint of the PCB stack. Its 0.4mm pitch allows for a high pin count of 60 positions in a length of only 13.14mm, optimizing board real estate. Additionally, the LCP housing is UL94V-0 rated and capable of withstanding standard SMT lead-free reflow temperatures.

Applications

Mobile Handheld Devices
Ideal for connecting primary PCBs to secondary daughterboards in smartphones or tablets where vertical clearance is extremely limited.
Wearable Technology
Used in smartwatches and fitness trackers to interface sensors or displays while maintaining a slim physical profile.
Compact Camera Modules
Provides a high-density interconnect for image sensors and processing boards in digital cameras or drone gimbals.
Medical Diagnostic Portables
Facilitates internal modular connections in handheld ultrasound or monitoring equipment requiring 60 signal lines.

Key Specifications

Pitch 0.016" (0.40mm)
Mounting Type Surface Mount
Connector Type Header, Center Strip Contacts
Contact Finish Gold
Number of Rows 2
Height Above Board 0.031" (0.80mm)
Number of Positions 60
Mated Stacking Heights 0.9mm
Contact Finish Thickness 2.00uin (0.051um)

Also Consider

DF30FC-60DS-0.4V(82) Hirose Electric Co Ltd - This is the matching 60-position receptacle required to complete the board-to-board mated pair.
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