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DP83867IRPAPRG4

TIDP83867IRPAPRG4

Texas Instruments
Ethernet ICs Industrial temperatu re robust gigabit E
Active978 in stock

Overview

The DP83867IRPAPRG4 is a robust, low-power Gigabit Ethernet Physical Layer (PHY) transceiver designed for industrial applications. It supports 10BASE-Te, 100BASE-TX, and 1000BASE-T protocols while offering extremely low latency through RGMII, GMII, and MII interfaces. This device is specifically engineered for high EMC performance, exceeding 8kV IEC 61000-4-2 ESD protection standards and meeting EN55011 class B emission limits.

Why Choose This Part

The transceiver offers ultra-low RGMII latency (TX < 90ns, RX < 290ns) and 16 programmable delay modes to simplify timing closure. It features integrated MDI termination resistors and programmable impedance to reduce external component count and PCB complexity. Its industrial design includes cable diagnostics and a fast link drop mode for mission-critical connectivity.

Applications

Industrial Ethernet Switches
Ideal for factory automation backplanes requiring high EMI resistance and low latency data transmission.
Time Sensitive Networking (TSN)
Compliant with TSN standards for precise data delivery in synchronized industrial control loops.
Precision Clocking
Utilizes Start of Frame Detect for IEEE 1588 time stamping and provides a synchronized 25MHz or 125MHz clock output.

Key Specifications

Function Physical Layer Controller
Protocol Ethernet
Interface GMII, MII, RGMII, Serial
Standards IEEE 802.3, 10/100/1000 Base-T/TX PHY
Package / Case 64-TQFP Exposed Pad
Current - Supply 141mA (Typ)
Voltage - Supply 0.95V ~ 1.155V, 1.045V ~ 1.89V, 1.71V, 2.375V ~ 2.625V
Operating Temperature -40degC ~ 85degC
Supplier Device Package 64-HTQFP (10x10)

Getting Started

Designers can evaluate the chip using the DP83867ERGZ-S-EVM or DP83867EVM-PDK evaluation modules from Texas Instruments. Configuration is typically performed via the MDIO/MDC management interface, and TI provides the SNLA246 application report to guide RGMII layout and timing optimization. Ensure the thermal pad on the 64-HTQFP package is properly soldered to a ground plane for heat dissipation and EMC performance.

Also Consider

KSZ9031RNXIA MCHPMicrochip Technology - A widely used alternative Gigabit PHY with RGMII support and integrated LDO controller.