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EE2-5NU

EE2-5NU

KEMET
General Purpose Relay DPDT (2 Form C) Surface Mount
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Overview

The EE2-5NU is a miniature signal relay from KEMET designed for high-density surface mount applications. This DPDT (2 Form C) relay features a low profile and a compact footprint of 15mm by 7.5mm, making it ideal for precision switching in space-constrained designs. It operates on a 5VDC coil and offers rapid response times with a 2ms operate time and 1ms release time.

Why Choose This Part

This relay provides excellent reliability with gold-over-silver alloy contacts and has earned UL, CSA, and TUV safety approvals. The surface mount design supports modern automated assembly processes, and its low power consumption of approximately 140mW (28mA at 5VDC) makes it suitable for energy-sensitive electronics.

Applications

Telecommunication Systems
Used in PBX, switching equipment, and terminal devices for reliable signal routing.
Test and Measurement
Suitable for signal path switching in automated test equipment and instrumentation due to its compact SMT package.
Industrial Control
Provides isolated switching for low-power signals in industrial communication interfaces and logic controllers.

Key Specifications

Coil Type Non Latching
Relay Type General Purpose
Coil Current 28 mA
Coil Voltage 5VDC
Contact Form DPDT (2 Form C)
Operate Time 2 ms
Release Time 1 ms
Mounting Type Surface Mount
Approval Agency CSA, TUV, UL
Contact Material Silver Alloy, Gold Alloy
Switching Voltage 250VAC, 220VDC - Max
Termination Style Gull Wing
Load - Max Switching 500VA, 440W
Must Operate Voltage 3.75 VDC
Must Release Voltage 0.5 VDC
Operating Temperature -40degC ~ 85degC
Contact Rating (Current) 2 A

Getting Started

When integrating the EE2-5NU, ensure a flyback diode is placed across the coil to protect driving circuitry from inductive spikes. Since this is a non-latching relay, the coil must remain energized to maintain the operated state. Refer to the footprint specifications for the 8-pin surface mount package to ensure proper pad alignment and thermal profile during reflow soldering.

Also Consider

IM03GR TE Connectivity - Offers a smaller overall footprint and lower profile for extremely high-density signal switching.