EmbeddedRelated.com
FUSB340TMX

ONFUSB340TMX

onsemi
USB Switch USB 3.1 USB Interface 18-TMLP (2x2.8)
Active7,008 in stock

Overview

The FUSB340TMX is a high-performance 2:1 or 1:2 differential data switch designed for USB 3.1 SuperSpeed applications. It provides a 10 Gbps bandwidth, allowing it to pass high-speed signals with minimum edge distortion while maintaining extremely low power consumption of 12uA typical. The device supports a wide supply voltage range from 1.5V to 5V, making it highly versatile for mobile and battery-powered systems.

Why Choose This Part

This switch offers an exceptional 10 GHz bandwidth, ensuring compatibility with USB 3.1 Gen 2 and PCIe Gen 3 signal integrity requirements. Its ultra-small 2mm x 2.8mm TMLP package and low 1uA shutdown current are ideal for space-constrained, power-sensitive portable electronics. Additionally, the 2 kV HBM ESD protection provides essential robustness for external-facing data ports.

Applications

USB Type-C Multiplexing
Swapping and routing SuperSpeed signals in USB Type-C connectors to support reversible plug orientation.
Mobile Device Data Routing
Switching between internal SuperSpeed controllers and external ports in smartphones and tablets.
High-Speed Storage Interfaces
Routing data paths for SATA or USB 3.1 Gen 2 external SSDs and drive enclosures.
DisplayPort Signal Switching
Managing DisplayPort 1.3 signal paths in docking stations and notebook computer video outputs.

Key Specifications

Function Switch
Protocol USB
Interface USB
Standards USB 3.1
Package / Case 18-XFQFN Exposed Pad
Current - Supply 12uA
Voltage - Supply 1.5V ~ 5V
Operating Temperature -40degC ~ 85degC
Supplier Device Package 18-TMLP (2x2.8)

Getting Started

When designing with the FUSB340TMX, ensure that high-speed differential traces are length-matched and use controlled impedance to maintain signal integrity at 10 Gbps. The SEL pin controls the data path, and the OE pin can be pulled high to enter a low-power shutdown mode. Evaluation can be performed using custom breakout boards or by integrating the component into a prototype PCB following the layout guidelines for SuperSpeed differential pairs.