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HCPL-0930-500E

HCPL-0930-500E

Broadcom Limited
General Purpose Digital Isolator 2500Vrms 2 Channel 110MBd 15kV/µs CMTI 8-SOIC (0.154", 3.90mm Width)
Active4,710 in stock

Overview

The HCPL-0930-500E is a dual-channel high-speed digital isolator utilizing Giant Magnetoresistive (GMR) technology to achieve 110MBd data rates. It provides 2500Vrms isolation in a compact 8-SOIC package and supports both 3.3V and 5V CMOS/TTL logic levels. This unidirectional isolator is designed for high-speed signal paths where galvanic isolation and high common-mode transient immunity (15kV/us) are required.

Why Choose This Part

The GMR technology allows for significantly lower power consumption (approximately 5.0mA per channel at 5V) compared to traditional optocouplers while supporting much higher data rates. It features 15kV/us common-mode rejection, ensuring reliable data transmission in electrically noisy environments.

Applications

Isolated SPI Bus
Providing high-speed isolation for SPI clock and data lines in industrial motor controllers.
Industrial Fieldbus Communication
Galvanically isolating RS-485, RS-232, or CAN bus logic signals from high-voltage transients.
Switching Power Supply Feedback
Bridging the primary and secondary sides of high-frequency power converters to maintain signal integrity.
Digital Logic Ground Isolation
Eliminating ground loops in mixed-signal systems between sensitive analog circuits and noisy digital processors.

Key Specifications

Type General Purpose
Data Rate 110MBd
Technology GMR (Giant Magnetoresistive)
Channel Type Unidirectional
Mounting Type Surface Mount
Isolated Power No
Package / Case 8-SOIC (0.154", 3.90mm Width)
Voltage - Supply 3V ~ 5.5V
Number of Channels 2
Voltage - Isolation 2500Vrms
Operating Temperature -55degC ~ 125degC
Inputs - Side 1/Side 2 2/0
Rise / Fall Time (Typ) 1ns, 1ns
Supplier Device Package 8-SOIC
Pulse Width Distortion (Max) 3ns
Propagation Delay tpLH / tpHL (Max) 15ns, 15ns
Common Mode Transient Immunity (Min) 15kV/us

Getting Started

To implement this device, place 0.1uF ceramic bypass capacitors as close as possible to the VDD1 and VDD2 pins. Ensure the PCB layout maintains the required creepage and clearance distances beneath the SO-8 package to preserve the 2500Vrms isolation rating.