HTSW-102-07-G-D
Samtec Inc.
Connector Header Through Hole 4 position 0.100" (2.54mm)
Active3,566 in stock
Overview
The HTSW-102-07-G-D is a high-temperature terminal strip from Samtec featuring 4 total positions in a dual-row (2x2) configuration. This vertical, through-hole header utilizes 0.100 inch (2.54mm) pitch spacing and is designed for reliable board-to-board or wire-to-board connections in standard industrial environments. The gold plating on the contact area ensures low resistance and long-term durability against oxidation.
Why Choose This Part
This header supports high-temperature soldering processes and provides a high current rating of 3A per contact. Its dual-row design offers a compact footprint while maintaining the standard 2.54mm pitch compatible with most prototype and production board layouts.
Applications
Board-to-Board Stacking
Establishing robust electrical connections between vertically stacked PCBs.
Internal Power Distribution
Routing up to 3A per pin to sub-assemblies or peripheral modules.
Mezzanine Card Interconnects
Providing a simple, unshrouded interface for removable daughter cards.
Key Specifications
Style
Board to Board or Cable
Shrouding
Unshrouded
Termination
Solder
Contact Type
Male Pin
Contact Shape
Square
Mounting Type
Through Hole
Connector Type
Header
Fastening Type
Push-Pull
Number of Rows
2
Pitch - Mating
0.100" (2.54mm)
Contact Material
Phosphor Bronze
Insulation Color
Natural
Insulation Height
0.100" (2.54mm)
Insulation Material
Liquid Crystal Polymer (LCP)
Number of Positions
4
Row Spacing - Mating
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Length - Post
0.100" (2.54mm)
Current Rating (Amps)
Varies by Wire Gauge
Operating Temperature
-55degC ~ 125degC
Overall Contact Length
0.430" (10.92mm)
Contact Finish - Mating
Gold
Contact Length - Mating
0.230" (5.84mm)
Number of Positions Loaded
All
Material Flammability Rating
UL94 V-0
Contact Finish Thickness - Mating
10.0uin (0.25um)
Also Consider
M20-9980245
Harwin
- A dual-row vertical header with 0.1 inch pitch suitable for similar board-to-board applications.
