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LAN9252V/ML

MCHPLAN9252V/ML

Microchip Technology
Ethernet Controller 10/100 Base-FX/T/TX PHY SPI Interface 64-QFN (9x9)
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Overview

The LAN9252V/ML is a high-performance 2-port EtherCAT slave controller with integrated dual 10/100 PHYs. It features a flexible SPI or 8/16-bit parallel interface to connect to a wide variety of microcontrollers, enabling standard embedded systems to communicate over industrial Ethernet networks. This controller includes 4KB of DPRAM and 3 Fieldbus Memory Management Units to handle complex real-time data exchange.

Why Choose This Part

The device simplifies PCB design by integrating the 1.2V regulator and physical layer components, requiring only a 25MHz crystal and a few passives. It offers robust low-power management with a shutdown current as low as 9uA and supports HP Auto-MDIX for automatic cable crossover detection. With 4 SyncManagers, it provides efficient buffering and synchronization for time-critical industrial data.

Applications

Industrial Motor Drives
Utilizes Distributed Clock support for precise synchronization in multi-axis motion control applications.
Robotic Actuators
Integrates EtherCAT connectivity into compact robotic joints using the space-saving 9x9mm QFN package.
IO-Link Gateways
Acts as the bridge between high-speed EtherCAT backbones and factory floor sensor networks.
Process Automation
Deploys in harsh environments requiring extended temperature operation from -40degC to 105degC.

Key Specifications

Function Controller
Protocol Ethernet
Interface SPI
Standards 10/100 Base-FX/T/TX PHY
Package / Case 64-VFQFN Exposed Pad
Voltage - Supply 1.8V ~ 3.3V
Operating Temperature -40degC ~ 105degC
Supplier Device Package 64-QFN (9x9)

Getting Started

Engineers can evaluate this controller using the EVB-LAN9252-SPI or EVB-LAN9252-HBI evaluation boards from Microchip. Software development is supported through the EtherCAT Slave Stack Code (SSC) tool, which helps generate the necessary configuration files and drivers for various MCU architectures. Ensure proper thermal dissipation by soldering the 64-QFN exposed pad to a solid ground plane.