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LG R971-KN-1-0-20-R18

LG R971-KN-1-0-20-R18

ams-OSRAM USA INC.
Green 570nm LED Indication - Discrete 2.2V 0805 (2012 Metric)
Active153,399 in stock

Overview

The LG R971-KN-1-0-20-R18 is a green surface-mount LED in a compact 0805 (2012 metric) package. Utilizing Chip LED technology with a white diffused lens, it provides a wide viewing angle of 160 degrees for consistent visibility. This 570nm wavelength device is designed for low-power indication and status signaling in space-constrained embedded systems.

Why Choose This Part

This LED features a low-profile height of 0.90mm and high corrosion robustness (Class 3B), making it reliable in challenging environments. It includes built-in ESD protection up to 2 kV according to HBM standards, reducing the need for external protection components. The 160-degree viewing angle ensures excellent off-axis visibility for user interface applications.

Applications

Status Indicators
Visual feedback for power rails, system heartbeats, or logic states on PCB assemblies.
Control Panels
Backlighting for small buttons or membrane switches in industrial and consumer interfaces.
Network Equipment
Activity and link status LEDs for RJ45 jacks or router front panels.
Battery-Powered Devices
Efficient 20mA test current operation suitable for portable electronics and wearables.

Key Specifications

Color Green
Lens Size 1.30mm x 1.25mm
Lens Color White
Lens Style Rectangle with Flat Top
Height (Max) 0.90mm
Configuration Standard
Mounting Type Surface Mount
Viewing Angle 160deg
Current - Test 20mA
Package / Case 0805 (2012 Metric)
Size / Dimension 2.00mm L x 1.25mm W
Lens Transparency Diffused
Wavelength - Peak 572nm
Millicandela Rating 26.05mcd
Wavelength - Dominant 570nm
Supplier Device Package 0805
Voltage - Forward (Vf) (Typ) 2.2V

Getting Started

Integrate this component into your PCB design using standard 0805 footprints with a current-limiting resistor based on the 2.2V forward voltage. Ensure the cathode marking is correctly oriented on the silkscreen to prevent reverse-bias conditions during assembly. The surface-mount package is compatible with standard automated pick-and-place and reflow soldering processes.

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