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LPC55S69JBD100E

LPC55S69JBD100E

NXP
Higher-pin-count member of the same LPC55S family for designs needing more I/O and peripherals.
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Overview

The LPC55S69JBD100E is a higher-pin-count member of NXP's LPC55S family: a dual-core ARM Cortex-M33 microcontroller running up to 150 MHz. It integrates 640 KB of on-chip flash, 320 KB of RAM, about 64 GPIOs, and a broad set of connectivity options including Flexcomm (SPI/I2C/UART), MMC/SD/SDIO, USB and I2S. The device supports common embedded peripherals such as DMA, PWM, RNG, watchdog and brown-out/por reset circuitry and runs from 1.8 V to 3.6 V supply.

Why Choose This Part

Choose this MCU when you need a mid- to high-performance embedded controller with generous on-chip flash and RAM, dual-core Cortex-M33 processing at up to 150 MHz, and a wide set of peripheral interfaces. The LPC55S69 family provides flexible Flexcomm channels so you can map UART/I2C/SPI as required, and integrated system peripherals (DMA, WDT, POR/BOD) simplify robust embedded designs. The wide supply range (1.8 V to 3.6 V) and 64 available I/Os make it adaptable to many board-level designs.

Applications

USB-connected devices
High-performance USB peripherals, hosts, or composite devices that need reliable USB connectivity plus general MCU I/O.
Data-logger and SD-card systems
Applications that require SD/MMC storage for logging or media with sufficient flash and RAM for buffering and file system stacks.
Audio and multimedia endpoints
I2S audio interfaces combined with DMA and PWM make the device suitable for simple audio playback, voice I/O, or codecs.
Industrial and motor control
Multiple PWM channels, lots of I/O and flexible serial interfaces are useful for motor drivers, motion control, and industrial controllers.
Protocol gateways and edge nodes
Plenty of RAM/flash and multiple serial interfaces let the MCU act as a bridge between field buses, sensors, and higher-level networks.

Key Specifications

Speed 150MHz
RAM Size 320K x 8
Core Size 32-Bit Dual-Core
Peripherals Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Mounting Type Surface Mount
Number of I/O 64
Core Processor ARM Cortex-M33
Package / Case 100-LQFP Exposed Pad
Data Converters A/D 10x16b SAR
Oscillator Type Internal
Program Memory Size 640KB (640K x 8)
Program Memory Type FLASH
Operating Temperature -40degC ~ 105degC (TA)
Supplier Device Package 100-HLQFP (14x14)
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V

Getting Started

Start development with NXP's MCUXpresso IDE and the MCUXpresso SDK for the LPC55S6x family; NXP supplies board support packages and example projects. Use the official LPC55S69 evaluation kit (NXP EVK) or a compatible development board plus a Segger J-Link or CMSIS-DAP debug probe for programming and tracing. You can build with MCUXpresso or arm-none-eabi-gcc toolchains and use vendor examples to get peripherals (Flexcomm, USB, I2S, SD) up and running quickly.

Part of NXP LPC family » LPC55

LPC55 Family

Comparing specs that differ across variants. The current part is highlighted.

Part Number Flash RAM I/O Pins Package ADC/DAC Connectivity Stock
LPC55S69JBD100E (this part) 640KB 320K 64 LQFP-100 A/D 10x16b SAR Flexcomm, I2C, MMC.. 441
LPC55S28JBD64K (NXP USA Inc.) 512KB 256K 36 TQFP-64 A/D 10x16b Flexcomm, I2C, MMC.. 2,030
LPC55S69JBD64E (NXP USA Inc.) 640KB 320K 36 TQFP-64 A/D 10x16b SAR Flexcomm, I2C, MMC.. 63
LPC55S69JBD64K (NXP USA Inc.) 640KB 320K 36 TQFP-64 A/D 10x16b Flexcomm, I2C, MMC.. 758
LPC55S66JBD100K (NXP USA Inc.) 256KB 144K 64 LQFP-100 A/D 10x16b Flexcomm, I2C, MMC.. 275
LPC55S16JBD100E (NXP USA Inc.) 256KB 96K 64 LQFP-100 A/D 10x16b SAR CAN FD, Flexcomm, .. 98
LPC55S26JBD64K (NXP Semiconductors) 256KB 144K 36 TQFP-64 A/D 10x16b Flexcomm, I2C, MMC.. 1,352
LPC55S28-EVK (NXP Semiconductors) — — — — — — 14
LPC55S69-EVK (NXP Semiconductors) — — — — — — 51
Also available as: LPC55S06JBD64E, LPC55S26JEV98K, LPC55S28JBD100E, LPC55S14JBD100E

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