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LRTBR48G RGB LED

LRTBR48G RGB LED

MPN: LRTBR48G-P9Q7-1+R7S5-26+NP-68-R33-ZB
ams-OSRAM USA INC.
Red, Green, Blue (RGB) 623nm Red, 530nm Green, 471nm Blue LED Indication - Discrete 1.95V Red, 2.7V Green, 2.7V Blue 0404 (1010 Metric)
Active529,239 in stock

Overview

The LRTBR48G is an ultra-compact 4-pin RGB LED designed for high-density color displays and indoor video walls. Measuring just 1.0mm x 1.0mm (0404), this common anode emitter uses a black surface package to provide high contrast and a 120-degree viewing angle. It features a Lambertian emission pattern with typical forward voltages of 1.95V for Red and 2.7V for Green and Blue.

Why Choose This Part

The 1010 metric footprint allows for extremely tight pixel pitch in display applications. Its black package enhances contrast ratios in video applications, while the low test current of 5-10mA ensures efficient power management in multi-pixel arrays.

Applications

Indoor Video Walls
Used in high-resolution LED screens where small pixel pitch is required for sharp image reproduction.
Status Indication
Compact RGB indicator for space-constrained consumer electronics and wearables.
Full-Color Displays
General purpose color mixing for architectural accents or specialized equipment dashboards.

Key Specifications

Color Red, Green, Blue (RGB)
Lens Size 1.00mm
Lens Style Square with Flat Top
Height (Max) 0.75mm
Configuration Common Anode
Mounting Type Surface Mount
Viewing Angle 120deg
Current - Test 10mA Red, 5mA Green, 5mA Blue
Package / Case 0404 (1010 Metric)
Size / Dimension 1.00mm L x 1.00mm W
Wavelength - Peak 632nm Red, 523nm Green, 455nm Blue
Wavelength - Dominant 623nm Red, 530nm Green, 471nm Blue
Supplier Device Package 4-SMD
Voltage - Forward (Vf) (Typ) 1.95V Red, 2.7V Green, 2.7V Blue

Getting Started

To drive these LEDs, use a multi-channel constant current LED driver or a microcontroller with PWM outputs and appropriate current-limiting resistors. Ensure the common anode is connected to the supply rail (1.6V to 3.4V range) and provide thermal relief in the PCB layout to manage heat dissipation in high-density configurations.