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LSM6DSV16BXTR

LSM6DSV16BXTR

STMicroelectronics
Accelerometer, Gyroscope, Temperature, 6 Axis Sensor I2C, I3C, SPI Output
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Overview

The LSM6DSV16BXTR is a high-performance 6-axis IMU featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope with a dedicated triple-channel architecture for motion tracking, bone conduction, and Qvar sensing. It integrates advanced features like a Machine Learning Core (MLC), a Programmable Finite State Machine (FSM), and an electrostatic charge sensing channel (Qvar) to offload complex processing from the host MCU. This sensor is specifically designed for an always-on experience with low power consumption, drawing as little as 0.95 mA in high-performance combo mode.

Why Choose This Part

This sensor excels in efficiency by combining a 4.5 KB Smart FIFO with on-chip AI processing tools like the Machine Learning Core and Finite State Machine. The addition of a Qvar sensor and a high-bandwidth audio accelerometer allows for multi-modal sensing in a compact 2.5x3 mm 14-LGA package. It supports modern high-speed interfaces including I3C and a TDM slave interface for seamless integration into digital audio and mobile platforms.

Applications

Bone Conduction Audio
Utilizes the high-bandwidth 3-axis audio accelerometer (>1 kHz) to capture vibrations for voice enhancement and noise cancellation.
Wearable Gesture Recognition
Employs the Machine Learning Core and Qvar sensing to detect complex user interactions and gestures with minimal power consumption.
Advanced Activity Tracking
Integrated pedometer, step detector, and significant motion detection for precision fitness monitoring.
Edge AI Applications
On-chip MLC allows for real-time classification of motion patterns without waking the application processor.

Key Specifications

Output Type I2C, I3C, SPI
Sensor Type Accelerometer, Gyroscope, Temperature, 6 Axis
Mounting Type Surface Mount
Package / Case 14-WFLGA
Operating Temperature -40degC ~ 85degC
Supplier Device Package 14-LGA (2.5x3)

Getting Started

Engineers can evaluate the sensor using the STEVAL-MKI235KA evaluation kit or the X-NUCLEO-IKS4A1 expansion board for the STM32 ecosystem. Software support is provided through the X-CUBE-MEMS1 functional pack, which includes drivers and pre-configured examples for the Machine Learning Core and FSM. Configuration of the AI features is typically performed using the Unicleo-GUI or AlgoBuilder tools from STMicroelectronics.

Also Consider

LSM6DSOX STMicroelectronics - A similar 6-axis IMU with Machine Learning Core but without the specialized Qvar sensing and bone conduction audio features.
BMI270 Bosch Sensortec - An ultra-low power IMU optimized for wearables, though it lacks the specific bone conduction bandwidth and integrated ML core of the LSM6DSV series.
ICM-42688-P TDK InvenSense - A high-precision 6-axis IMU focused on low noise and high stability for navigation and robotics.

Categories

Sensors > IMU & Accelerometers