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MAX17545ATP+T

ADIMAX17545ATP+T

Analog Devices Inc./Maxim Integrated
Buck Switching Regulator IC Positive Adjustable 0.9V 1 Output 1.7A 20-WFQFN Exposed Pad
Active2,415 in stock
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Overview

The MAX17545ATP+T is a high-efficiency, synchronous step-down DC-DC converter with integrated MOSFETs that operates over a wide input voltage range of 4.5V to 42V. It delivers up to 1.7A of output current with an adjustable output voltage from 0.9V up to 37.8V. The device employs a peak-current-mode control architecture and can be operated in PWM, PFM, or DCM modes to optimize efficiency across various load conditions.

Why Choose This Part

The regulator eliminates the need for an external Schottky diode through synchronous operation, reducing board space and improving thermal performance. It supports all-ceramic capacitor designs and features internal compensation, simplifying the BOM and stabilizing the feedback loop across the entire output range.

Applications

Industrial Power Supplies
Ideal for 24V industrial bus regulation due to its 42V maximum input rating and high efficiency.
Distributed Supply Regulation
Used in systems requiring localized point-of-load conversion from high-voltage intermediate rails.
Base Station Power
Suitable for telecommunications infrastructure requiring robust, wide-input voltage buck regulation.
General Purpose Step-Down
Replaces bulky non-synchronous regulators in space-constrained designs thanks to its integrated compensation and TQFN package.

Key Specifications

Function Step-Down
Topology Buck
Output Type Adjustable
Mounting Type Surface Mount
Package / Case 20-WFQFN Exposed Pad
Current - Output 1.7A
Number of Outputs 1
Output Configuration Positive
Frequency - Switching 100kHz ~ 2.2MHz
Operating Temperature -40degC ~ 125degC (TJ)
Synchronous Rectifier Yes
Voltage - Input (Max) 42V
Voltage - Input (Min) 4.5V
Voltage - Output (Max) 37.8V
Supplier Device Package 20-TQFN (4x4)
Voltage - Output (Min/Fixed) 0.9V

Getting Started

Designers should utilize the MAX17545EVKIT# evaluation kit to verify thermal performance and efficiency benchmarks. Ensure the exposed pad is soldered to a large ground plane for optimal heat dissipation as specified in the 20-pin TQFN-EP package requirements.

MAX17545 Family

Also available as: MAX17545ATP+