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MAX5969AETB+T

ADIMAX5969AETB+T

Analog Devices Inc./Maxim Integrated
Power Over Ethernet Controller 1 Channel 802.3at (PoE+), 802.3af (PoE) 10-TDFN (3x3)
Active8,335 in stock

Overview

The MAX5969AETB+T is a high-performance Power-over-Ethernet (PoE) Powered Device (PD) controller fully compliant with IEEE 802.3at (PoE+) and 802.3af standards. It integrates a complete interface for PD systems, including 2-event classification, a power MOSFET, and current-limiting circuitry to simplify power management in networked hardware. This controller is designed to handle up to 25.5W of power while maintaining a small footprint with its 3x3mm 10-pin TDFN package.

Why Choose This Part

This controller features a 100V absolute maximum input rating, providing robust protection against line transients. It includes an integrated power MOSFET and features a 180mA maximum inrush current limit to prevent power-up glitches on the network. The MAX5969A variant specifically provides a legacy UVLO threshold of 36V, ensuring compatibility with various power sourcing equipment environments.

Applications

IP Surveillance Cameras
Provides reliable PoE+ power management for high-definition security cameras with pan-tilt-zoom (PTZ) capabilities.
Wireless Access Points
Enables efficient power delivery for 802.11n/ac enterprise Wi-Fi routers through standard Ethernet cabling.
VOIP Terminals
Supports power requirements for feature-rich voice-over-IP desk phones and conferencing systems.
Industrial Sensors
Facilitates data and power delivery over a single cable for smart factory floor sensors and automation nodes.

Key Specifications

Type Controller (PD)
Standards 802.3at (PoE+), 802.3af (PoE)
Power - Max 25.5 W
Mounting Type Surface Mount
Package / Case 10-WFDFN Exposed Pad
Auxiliary Sense Yes
Current - Supply 270uA
Voltage - Supply 40V ~ 60V
Internal Switch(s) Yes
Number of Channels 1
Operating Temperature -40degC ~ 85degC
Supplier Device Package 10-TDFN (3x3)

Getting Started

Designers should refer to the MAX5969A evaluation kit (MAX5969AEVKIT#) for a reference layout and performance validation. Ensure the exposed pad of the TDFN package is soldered to a large ground plane to manage thermal dissipation during high-power 25.5W operation. The device requires minimal external components, primarily requiring a bypass capacitor and an external wall-adapter sense resistor if using auxiliary power.

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