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MPF100T-FCSG325I

MCHPMPF100T-FCSG325I

Microchip Technology
PolarFire™ Field Programmable Gate Array (FPGA) IC 170 7782400 109000 325-LFBGA, FCBGA
Active13 in stock

Overview

The MPF100T-FCSG325I is a mid-range PolarFire FPGA from Microchip designed for low power consumption and high security in a compact 11x11mm package. It features 109,000 logic elements and over 7.7 megabits of total RAM, offering a balance of performance and thermal efficiency for space-constrained designs.

Why Choose This Part

This FPGA offers significantly lower static power compared to SRAM-based alternatives, reducing thermal management requirements. Its non-volatile architecture provides inherent security against bitstream tampering and SEU (Single Event Upset) immunity, making it ideal for high-reliability environments.

Applications

Industrial Imaging
High-speed processing for machine vision cameras and industrial sensor fusion where low power is critical.
Secure Communication Gateways
Utilizing built-in security features and dedicated I/O for encrypted industrial networking.
Edge AI Inference
Running localized neural network models at the edge with high power-per-watt efficiency.
Motor Control and Robotics
Managing complex multi-axis control loops with deterministic timing and low latency.

Key Specifications

Mounting Type Surface Mount
Number of I/O 170
Package / Case 325-LFBGA, FCBGA
Total RAM Bits 7782400
Voltage - Supply 0.97V ~ 1.08V
Operating Temperature -40degC ~ 100degC (TJ)
Supplier Device Package 325-FCBGA (11x11)
Number of Logic Elements/Cells 109000

Getting Started

Development begins with Microchip Libero SoC Design Suite, which handles synthesis, floorplanning, and timing analysis. Hardware evaluation can be performed using the PolarFire Splash Kit or the PolarFire Video and Imaging Kit, which support the MPF100T series.

Also Consider

Artix-7 XC7A100T AMD Xilinx - A common alternative for high-performance DSP applications with extensive third-party IP support.
MPF200T-FCSG325I MCHPMicrochip Technology - Drop-in compatible upgrade providing double the logic density (200k LEs) in the same physical footprint.