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MTSW-108-07-G-S-210

Samtec Inc.
Connector Header Through Hole 8 position 0.100" (2.54mm)
Active687 in stock

Overview

The MTSW-108-07-G-S-210 is a single-row, 8-position through-hole header from Samtec's MTSW series. This connector features a standard 0.100 inch (2.54mm) pitch and is designed for board-to-board or cable mating applications where custom tail or post lengths are required. It utilizes phosphor bronze contacts with gold plating for reliable electrical performance in demanding environments.

Why Choose This Part

The header features a high operating temperature range of -55C to 125C, making it suitable for rugged industrial environments. It provides flexibility with a cuttable design and a 3.4A current rating per pin, supporting both signal and low-power distribution tasks.

Applications

Custom Board Stacking
Ideal for mezzanine or sandwich-style PCB arrangements requiring a specific separation height.
Industrial Control Systems
Used in PLC and automation modules for robust signal distribution between internal boards.
Prototyping and Breakout Boards
Standard 2.54mm pitch allows for easy integration with standard perfboards and development shield interfaces.

Key Specifications

Style Board to Board or Cable
Shrouding Unshrouded
Termination Solder
Contact Type Male Pin
Contact Shape Square
Mounting Type Through Hole
Connector Type Header, Cuttable
Fastening Type Push-Pull
Number of Rows 1
Pitch - Mating 0.100" (2.54mm)
Contact Material Phosphor Bronze
Insulation Color Black
Insulation Height 0.100" (2.54mm)
Insulation Material Polyester, Glass Filled
Number of Positions 8
Contact Finish - Post Gold
Contact Length - Post 0.120" (3.05mm)
Current Rating (Amps) 3A
Operating Temperature -55degC ~ 125degC
Overall Contact Length 0.430" (10.92mm)
Contact Finish - Mating Gold
Contact Length - Mating 0.210" (5.33mm)
Number of Positions Loaded All
Material Flammability Rating UL94 V-0
Contact Finish Thickness - Mating 10.0uin (0.25um)

Also Consider

961108-6404-AR 3M - Provides a similar gold-plated 8-position through-hole header solution for board-to-board connectivity.