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MX25L3233FM2I-08G

MX25L3233FM2I-08G

Macronix
FLASH - NOR Memory IC 32Mbit SPI - Quad I/O 133 MHz 8-SOP
Active20,782 in stock

Overview

The MX25L3233FM2I-08G is a 32Mbit CMOS Multi-I/O Serial NOR Flash memory chip featuring a high-speed SPI interface. It supports Quad I/O operations with clock frequencies up to 133 MHz, providing high throughput for embedded code execution and data storage. The device operates from a 2.65V to 3.6V supply and is housed in an 8-pin SOP package.

Why Choose This Part

This device offers high performance with 133 MHz Quad I/O support and low power consumption, drawing only 3uA in deep power-down mode. It includes advanced features such as block lock protection, a 4K-bit secured OTP area, and supports Serial Flash Discoverable Parameters (SFDP) for easier software integration.

Applications

Firmware Storage
Storing boot code and application firmware for microcontrollers in consumer and industrial electronics.
Execute-in-Place (XiP)
Directly executing code from flash memory using high-speed Quad SPI to reduce system RAM requirements.
Configuration Logging
Preserving user settings, calibration data, and system logs in a non-volatile format for embedded systems.

Key Specifications

Technology FLASH - NOR
Memory Size 32Mbit
Memory Type Non-Volatile
Memory Format FLASH
Mounting Type Surface Mount
Package / Case 8-SOIC (0.209", 5.30mm Width)
Clock Frequency 133 MHz
Memory Interface SPI - Quad I/O
Voltage - Supply 2.65V ~ 3.6V
Memory Organization 8M x 4
Operating Temperature -40degC ~ 85degC (TA)
Supplier Device Package 8-SOP
Write Cycle Time - Word, Page 50us, 1.2ms

Getting Started

Integrate the device into your hardware design using a standard SPI or Quad-SPI peripheral on your MCU. Use the SFDP table to automatically discover memory parameters or utilize standard JEDEC ID commands for driver initialization. Ensure proper decoupling with a 0.1uF capacitor close to the VCC pin.

Also Consider

W25Q32JVSSIQ Winbond Electronics - A widely used 32Mbit alternative with similar Quad SPI performance and package compatibility.