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PIC18F25K80-I/SP

MCHPPIC18F25K80-I/SP

Microchip Technology
PIC PIC® XLP™ 18K Microcontroller IC 8-Bit 64MHz 32KB (16K x 16) FLASH 28-SPDIP
Active3,360 in stock
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Overview

The PIC18F25K80-I/SP is a high-performance 8-bit microcontroller featuring an integrated ECAN module for robust automotive and industrial communication. Built with nanoWatt XLP technology, it provides exceptionally low power consumption in sleep modes while operating at speeds up to 64MHz. This variant comes in a 28-pin SPDIP package, making it ideal for through-hole prototyping and breadboard development.

Why Choose This Part

The integrated ECAN module provides a hardware-level solution for CAN 2.0B networking, reducing CPU overhead compared to software implementations. Its 28-DIP package is a rare find for modern CAN-enabled microcontrollers, significantly simplifying assembly for low-volume industrial hardware and hobbyist projects.

Applications

Automotive CAN Nodes
Utilizing the integrated ECAN 2.0B active module for vehicle sensor monitoring and lighting control.
Industrial Sensor Gateways
Bridging analog sensors to a LIN or CAN network in high-temperature factory environments.
Battery-Powered Remote Telemetry
Leveraging nanoWatt XLP sleep modes and the 12-bit ADC for long-term monitoring applications.
Through-Hole Prototyping
Designing proof-of-concept CAN bus systems on standard 0.1-inch pitch breadboards.

Key Specifications

Speed 64MHz
RAM Size 3.6K x 8
Core Size 8-Bit
EEPROM Size 1K x 8
Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity ECANbus, I2C, LINbus, SPI, UART/USART
Mounting Type Through Hole
Number of I/O 24
Core Processor PIC
Package / Case 28-DIP (0.300", 7.62mm)
Data Converters A/D 8x12b
Oscillator Type Internal
Program Memory Size 32KB (16K x 16)
Program Memory Type FLASH
Operating Temperature -40degC ~ 85degC (TA)
Supplier Device Package 28-SPDIP
Voltage - Supply (Vcc/Vdd) 1.8V ~ 5.5V

Getting Started

To begin development, use the MPLAB X IDE and an XC8 compiler along with a PICkit 4 or MPLAB Snap debugger connected via the ICSP pins. For rapid hardware testing, the 28-pin SPDIP package can be inserted directly into a breadboard or a standard IC socket. Microchip's ECAN library simplifies the configuration of baud rates and message filters for the networking stack.

Part of PIC18F25xx family » PIC18F25

PIC18F25 Family

Comparing specs that differ across variants. The current part is highlighted.

Part Number Flash RAM I/O Pins Package Speed ADC/DAC Stock
PIC18F25K80-I/SP (this part) 32KB 3.6K 24 DIP-28 64M A/D 8x12b 3,360
PIC18F25K40-I/ML 32KB 2K 25 VQFN-28 64M A/D 35x10b; D/A 1x5b 976
PIC18F25K42-I/SS 32KB 2K 25 SSOP-28 64M A/D 24x12b; D/A 1x5b 1,388
PIC18F25K22-I/SP 32KB 1.5K 24 DIP-28 64M A/D 19x10b 8,237
PIC18F25K42-E/ML 32KB 2K 25 VQFN-28 64M A/D 24x12b; D/A 1x5b —
PIC18F25K50-I/SP 32KB 2K 22 DIP-28 48M A/D 14x10b 672
PIC18F25Q10-I/ML 32KB 2K 25 VQFN-28 64M A/D 24x10b; D/A 1x5b 3,538
PIC18F25K50-I/SO 32KB 2K 22 SOIC-28 48M A/D 14x10b 2,498
PIC18F25K42-I/ML 32KB 2K 25 VQFN-28 64M A/D 24x12b; D/A 1x5b 2,717
PIC18F25K42-I/SP 32KB 2K 25 DIP-28 64M A/D 24x12b; D/A 1x5b 558
PIC18F25K40-I/SO 32KB 2K 25 SOIC-28 64M A/D 35x10b; D/A 1x5b 1,123
PIC18F25Q10-I/SP 32KB 2K 25 DIP-28 64M A/D 24x10b; D/A 1x5b 14,009
PIC18F25K83-E/ML 32KB 2K 25 VQFN-28 64M A/D 24x12b; D/A 1x5b 2,717
PIC18F25Q10-E/ML 32KB 2K 25 VQFN-28 64M A/D 24x10b SAR; D/.. 645
PIC18F25K50-I/ML 32KB 2K 22 VQFN-28 48M A/D 14x10b 523
PIC18F25Q10-E/SO 32KB 2K 25 SOIC-28 64M A/D 24x10b SAR; D/.. 710
PIC18F25K50-I/SS 32KB 2K 22 SSOP-28 48M A/D 14x10b 1,906
PIC18F25K80-I/SO 32KB 3.6K 24 SOIC-28 64M A/D 8x12b 613
PIC18F25K42-I/MV 32KB 2K 25 UFQFN-28 64M A/D 24x12b; D/A 1x5b 973
PIC18F25K22-I/ML 32KB 1.5K 24 VQFN-28 64M A/D 19x10b 752
PIC18F25K80-I/SS 32KB 3.6K 24 SSOP-28 64M A/D 8x12b 1,799

Also Consider

PIC18F25K80-I/SS MCHPMicrochip Technology - The same silicon in a surface-mount SSOP-28 package for reduced PCB footprint in production.
PIC18F26K83-I/SP MCHPMicrochip Technology - A more modern PIC18 variant with 64KB Flash and Core Independent Peripherals in the same 28-DIP form factor.