IFXS25FL256SAGBHV200
Overview
The S25FL256SAGBHV200 is a high-performance 256Mbit (32MB) CMOS 3.0V Core SPI Flash memory device. It supports Quad I/O and Double Data Rate (DDR) read operations, enabling high-throughput data transfer for demanding embedded applications. Housed in a 24-ball BGA package, it is rated for extended industrial temperatures up to 105 degrees Celsius.
Why Choose This Part
The device features a high clock frequency of 133 MHz and Quad DDR support for maximum bandwidth. Its MirrorBit technology provides high density and reliability, while the industrial-plus temperature rating of -40C to +105C ensures stability in extreme environments. The 24-ball BGA package offers a compact footprint and high mechanical reliability for surface mount assemblies.
Applications
Key Specifications
Getting Started
Engineers can interface with this memory using standard SPI, Dual, or Quad I/O drivers available in most MCU SDKs. When designing the PCB, ensure short trace lengths for the 133 MHz clock signal and include proper decoupling capacitors for the 2.7V to 3.6V supply. Consult the Infineon FL-S family datasheet for specific command sets and sector erase timings.
S25FL256S Family
Comparing specs that differ across variants. The current part is highlighted.
| Part Number | Package | Temp Range | Stock |
|---|---|---|---|
| S25FL256SAGBHV200 (this part) | TBGA-24 | -40degC ~ 105degC .. | 845 |
| S25FL256SAGNFI001 | WDFN-8 | -40degC ~ 85degC (.. | 1,533 |
| S25FL256SAGNFB000 | WDFN-8 | -40degC ~ 105degC .. | 664 |



