SFW20S-2STAE1LF
Amphenol ICC (FCI)
20 Position FPC Connector Contacts, Vertical - 1 Sided 0.039" (1.00mm) Surface Mount
Active9,958 in stock
Overview
The SFW20S-2STAE1LF is a 20-position FPC connector featuring a 1.0mm pitch and a vertical (straight) orientation. This Zero Insertion Force (ZIF) connector is designed for surface mount applications and provides a secure, one-sided contact interface for flexible printed circuits. It is rated for 100V and 1A, with a robust operating temperature range of -55C to 105C.
Why Choose This Part
The ZIF mechanism minimizes mechanical stress on the FPC during insertion, extending the life of the flexible cable. Its vertical orientation allows for a smaller PCB footprint compared to right-angle connectors, while the gold-plated phosphor bronze contacts ensure reliable electrical performance with a low 30mOhm contact resistance.
Applications
Internal Board-to-Board Interconnects
Connecting small LCD modules or capacitive touch panels to a main control board in industrial or consumer devices.
Peripheral Integration
Interfacing sensor arrays or specialized keypad membranes where a vertical FPC entry is required for space efficiency.
Handheld Device Prototyping
Used in compact electronics where flexible cabling reduces weight and improves routing within tight enclosures.
Key Specifications
Pitch
0.039" (1.00mm)
Features
Zero Insertion Force (ZIF)
Termination
Solder
Mounting Type
Surface Mount
Contact Finish
Gold
Flat Flex Type
FPC
Voltage Rating
100V
Contact Material
Phosphor Bronze
Housing Material
Thermoplastic, Glass Filled
Actuator Material
Thermoplastic, Glass Filled
FFC, FCB Thickness
0.33mm
Height Above Board
0.209" (5.30mm)
Number of Positions
20
Operating Temperature
-55degC ~ 85degC
Connector/Contact Type
Contacts, Vertical - 1 Sided
Material Flammability Rating
UL94 V-0
Also Consider
52271-2079
Molex
- A 1.0mm pitch ZIF connector with a bottom-contact configuration and similar 20-position density.
0522072033
Molex
- An alternative 1.0mm pitch vertical FPC connector for applications requiring different housing dimensions.
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