SHUTTLE BOARD 3.0 BMP384

Overview

The SHUTTLE BOARD 3.0 BMP384 is a compact evaluation platform designed for the BMP384 high-precision barometric pressure sensor. This board features a standardized 14-pin footprint with castellated pads that facilitate easy integration into development environments via a 1.27mm pitch interface. It provides direct access to the sensor's I2C and SPI digital interfaces for rapid prototyping of altitude and pressure sensing applications.

Why Choose This Part

The board supports a wide supply voltage range from 1.62V to 3.60V, making it compatible with various low-power MCU platforms. Its compact 22mm x 17.78mm PCB design with 8 available GPIO pins allows for flexible hardware configurations and straightforward breadboard mounting.

Applications

Getting Started

Connect the shuttle board to the Bosch Sensortec Application Board 3.0 or any microcontroller via the SPI or I2C headers. Use the provided 1.27mm pitch castellated pads to solder the board onto a carrier or use jumper wires for breadboard testing. Ensure the VDD supply is within the 1.62V to 3.60V range before initializing the sensor over the digital interface.

SHUTTLE BOARD 3.0 Family

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