Shuttle Board 3.0 BMP585

Overview

The Shuttle Board 3.0 BMP585 is an evaluation platform for the BMP585 barometric pressure sensor, designed for easy integration into development environments. It breaks out the sensor pins to a standard 14-pin header, allowing engineers to test the high-performance liquid-resistant pressure sensor without custom PCB fabrication. The board supports both SPI and I2C digital interfaces across a wide supply voltage range from 1.7V to 3.6V.

Why Choose This Part

This shuttle board allows for rapid prototyping by providing a pre-soldered BMP585 in a 14mm x 22mm form factor that is compatible with Bosch Sensortec evaluation tools. It handles the sensitive soldering requirements of the MEMS package while providing reliable access to the SPI and I2C communication pins.

Applications

Getting Started

Connect the 14-pin header to a Bosch Sensortec Application Board 3.0 or a standard breadboard using jumper wires. Ensure the VDD is within the 1.7V to 3.6V range and select the desired interface by pulling the CSB pin high for I2C or low for SPI. Bosch provides official C drivers and API examples on GitHub to accelerate software integration.

SHUTTLE BOARD 3.0 Family

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