RENSLG46537V-DIP
Overview
The SLG46537V-DIP is a development adapter that breaks out the SLG46537 GreenPAK Configurable Mixed-Signal Integrated Circuit (CMIC) into a breadboard-friendly DIP format. This platform allows engineers to prototype custom hardware logic, analog comparators, and timing functions without the need for custom PCB fabrication. The underlying SLG46537 IC features an Asynchronous State Machine and I2C connectivity for flexible system integration.
Why Choose This Part
The GreenPAK architecture offers a unique middle ground between discrete logic and small FPGAs, providing sub-microamp standby current and operating voltages down to 1.71V. Its asynchronous state machine and programmable delay blocks allow for precise timing control that is deterministic and independent of MCU software latency.
Applications
Key Specifications
Getting Started
Design logic using the free Go Configure Software Hub, which provides a schematic-capture interface for routing the internal macrocells. Once the design is simulated, it can be programmed onto the SLG46537V chip using the GreenPAK Advanced Development Board. The DIP adapter then allows for immediate testing on a standard solderless breadboard.
SLG46537V Family
| Part Number | Difference | Stock |
|---|---|---|
| SLG46537V | I/O: 17 · Pkg: UFQFN-20 · Pkg: STQFN-20 | 2,975 |
