EmbeddedRelated.com
    Parts    SMD291
SMD291

SMD291

Chip Quik
Soldering Flux Tack Flux No-clean 10cc w/Plunger & Tip
308 in stock
Datasheet Mouser Compare Prices

Overview

SMD291 is a professional-grade tacky flux designed specifically for the soldering and rework of surface-mount components. It features a non-corrosive, non-conductive formula that is classified as no-clean, meaning it does not require washing after the soldering process is complete. The 10cc syringe includes a plunger and a dispensing tip for precise application on fine-pitch components.

Why Choose This Part

The tacky consistency prevents the flux from running off the target area, which is critical when using hot air tools. Its no-clean formulation saves time in the prototyping phase by eliminating the need for specialized solvent cleaning cycles. The long shelf life and stable viscosity make it a reliable choice for both high-volume production environments and occasional lab use.

Applications

SMT Rework
Removing and replacing surface-mount components such as QFPs, SOICs, and discrete passives using hot air or soldering irons.
BGA Reballing
Providing the necessary tackiness to hold solder spheres in place during the reflow process of Ball Grid Array packages.
Manual Prototyping
Assisting in the hand-soldering of fine-pitch ICs to prevent bridging and ensure proper wetting of pads.
General PCB Repair
Cleaning and prepping oxidized pads on existing circuit boards to ensure reliable electrical connections during repair.

Getting Started

Apply a small amount of flux directly to the PCB pads or component leads before soldering. For best results with surface-mount ICs, apply a thin line across the pads and use a drag-soldering technique or hot air station. Although it is a no-clean flux, any visible residue can be removed with isopropyl alcohol (IPA) or a dedicated flux remover if a pristine board finish is required.