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SMDLTLFP10T4

SMDLTLFP10T4

Chip Quik Inc.
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 1.23 oz (35g), 10cc
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Overview

SMDLTLFP10T4 is a lead-free, no-clean solder paste formulated with a Bismuth-Tin-Silver alloy (Bi57.6/Sn42/Ag0.4). It features a low melting point of 138 degrees Celsius (281 degrees Fahrenheit), making it ideal for temperature-sensitive components and multi-stage soldering processes. This dispense-grade paste is provided in a 10cc syringe for precise application on high-density PCBs.

Why Choose This Part

The low 138 degree Celsius melting point significantly reduces thermal stress on substrates and components while providing a wide process window. Its no-clean synthetic flux leaves a clear, low-voiding residue that does not require post-process washing for most applications.

Applications

Heat-Sensitive Component Assembly
Used for soldering LEDs, plastic-bodied connectors, and delicate sensors that cannot withstand the high temperatures of standard SAC305 reflow profiles.
Multi-Stage Reflow
Enables a second soldering step on a board without reflowing or disturbing existing components previously soldered with higher-temperature alloys.
Prototype PCB Assembly
Facilitates manual assembly of T4 mesh pitch components (20-38 micron) using a hot air rework station or hobbyist reflow oven.

Key Specifications

Form Syringe, 1.23 oz (35g), 10cc
Type Solder Paste
Process Lead Free
Flux Type No-Clean
Mesh Type 4
Shelf Life 6 Months
Composition Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Melting Point 281degF (138degC)
Shelf Life Start Date of Manufacture
Storage/Refrigeration Temperature 37degF ~ 46degF (3degC ~ 8degC)

Getting Started

Store the syringe refrigerated between 3 and 8 degrees Celsius to maintain its 6-month shelf life, ensuring it reaches room temperature before use. Apply using the included plunger or a pneumatic dispenser, then reflow using a profile that peaks above 138 degrees Celsius, typically around 165-170 degrees Celsius for optimal wetting.

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