SMDLTLFP15T4 Low Temp Solder Paste
Overview
The SMDLTLFP15T4 is a lead-free, low-temperature solder paste kit from Chip Quik featuring a Sn42/Bi57.6/Ag0.4 alloy. It is provided in a two-part mix format (15g) specifically designed for applications where heat-sensitive components or multi-stage reflow processes require a low melting point of 138C (281F).
Why Choose This Part
This bismuth-based alloy offers a significant reduction in thermal stress on PCBs and components compared to standard lead-free solders. The two-part mix ensures the paste remains fresh until needed, avoiding the shelf-life degradation typical of pre-mixed solder pastes.
Applications
Getting Started
Mix the two components thoroughly according to the ratios provided in the kit before application. Use a fine-tip spatula or stencil for placement on pads, and ensure the reflow profile targets a peak temperature well below the standard 245C to take advantage of the 138C liquidus point.
