EmbeddedRelated.com
The 2026 Embedded Online Conference
SN74AVC4T245

TISN74AVC4T245

Texas Instruments
4-bit dual-supply translator with direction-control pin for cases needing an explicit direction signal.
Active15,182 in stock

Overview

The SN74AVC4T245 is a 4-bit non-inverting bus transceiver that uses two separate configurable power-supply rails to translate voltages between 1.2V and 3.6V. It features a direction-control pin for managing data flow between the A and B ports, making it ideal for interfacing low-voltage processors with higher-voltage peripherals or legacy logic.

Why Choose This Part

This transceiver supports VCC isolation, ensuring that if either VCC input is at ground, all outputs enter a high-impedance state to prevent backflow. It includes Ioff circuitry for partial-power-down mode operation and provides robust ESD protection and latch-up performance exceeding 100mA.

Applications

Mixed-Voltage Logic Interfacing
Connecting 1.8V or 1.2V microcontrollers to 3.3V sensors and communication modules.
SD Card Level Shifting
Translating signals between a low-voltage SoC and standard 3.3V SDIO interfaces.
SPI Bus Translation
Handling high-speed SPI data lines that require bi-directional level shifting with explicit direction control.
I/O Expansion
Managing data bus width expansion in systems with disparate voltage domains.

Key Specifications

Logic Type Translation Transceiver
Output Type 3-State
Mounting Type Surface Mount
Package / Case 16-VFQFN Exposed Pad
Voltage - Supply 1.2V ~ 3.6V
Number of Elements 2
Operating Temperature -40degC ~ 85degC (TA)
Supplier Device Package 16-VQFN (4x3.5)
Current - Output High, Low 12mA, 12mA
Number of Bits per Element 2

Getting Started

When designing with the SN74AVC4T245, ensure the VCCA and VCCB rails are properly decoupled with 0.1uF capacitors placed close to the pins. Since this is a direction-controlled translator, the DIR pin must be driven by the host controller to define the data path. For evaluation, the device is available in standard SOIC and VQFN packages compatible with common breakout boards and SMT prototyping workflows.

The 2026 Embedded Online Conference