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TCAN28475RHBRQ1

TITCAN28475RHBRQ1

Texas Instruments
System Basis Chip Interface 32-VQFN (5x5)
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Overview

The TCAN28475RHBRQ1 is a highly integrated automotive System Basis Chip (SBC) that combines a CAN FD transceiver and a LIN transceiver into a single 32-VQFN package. It simplifies power management by providing up to three integrated regulators and four high-side switches for controlling loads up to 150mA. This Functional Safety Quality-Managed device supports a wide input voltage range from 5.5V to 28V and features a 500-byte EEPROM for non-volatile configuration storage.

Why Choose This Part

This SBC reduces PCB footprint by consolidating multiple power regulators, a CAN FD transceiver, and a LIN transceiver into a 5x5mm package with wettable flanks for easier optical inspection. It offers extremely low power consumption in standby and sleep modes, drawing only 50uA, while providing comprehensive diagnostic and protection features to improve system-level reliability.

Applications

Automotive Body Control Modules
Managing power distribution and multi-protocol communication for central gateway and body electronics.
Industrial Networking
Providing robust CAN FD and LIN physical layers for industrial automation systems requiring high reliability.
Vehicle Comfort Systems
Powering and communicating with seat modules, door modules, and climate control units via integrated high-side switches.
Functional Safety Applications
Use in systems requiring Quality-Managed diagnostic features and protection for critical vehicle bus communication.

Key Specifications

Interface CAN, SPI
Applications System Basis Chip
Mounting Type Surface Mount, Wettable Flank
Package / Case 32-VFQFN Exposed Pad
Voltage - Supply 5.5V ~ 28V
Supplier Device Package 32-VQFN (5x5)

Getting Started

Evaluate the device using Texas Instruments evaluation modules (EVMs) designed for the TCAN series. Configure the device's internal registers and 500-byte EEPROM via the SPI interface to tune regulator outputs and wake-up behaviors. Ensure proper thermal management by utilizing the 32-VFQFN exposed pad for heat dissipation on the PCB.