EmbeddedRelated.com
The 2026 Embedded Online Conference
TLV9062IDR

TITLV9062IDR

Texas Instruments
CMOS Amplifier 2 Circuit Rail-to-Rail 8-SOIC
Active11,085 in stock

Overview

The TLV9062IDR is a dual-channel, low-voltage CMOS operational amplifier designed for cost-sensitive applications requiring a balance of speed and power efficiency. It features rail-to-rail input and output capabilities across a 1.8V to 5.5V supply range, making it suitable for modern low-voltage microcontroller signal conditioning. With a 10 MHz gain bandwidth product and integrated RFI/EMI filtering, it provides robust performance in electrically noisy environments.

Why Choose This Part

This amplifier offers a high 10 MHz bandwidth while consuming only 538 uA of supply current per channel. Its integrated EMI and RFI filters simplify design by reducing the need for external decoupling components in sensitive analog front-ends. Additionally, the low input bias current of 0.5 pA makes it ideal for applications involving high-impedance sources.

Applications

Low-Side Current Sensing
Utilizing the rail-to-rail input capability to monitor current across a shunt resistor near ground.
Sensor Signal Conditioning
Buffering and amplifying high-impedance sensor outputs with ultra-low 0.5 pA input bias current.
Active Filtering
Implementing high-order low-pass or band-pass filters in battery-powered instrumentation.
ADC Buffering
Driving the inputs of 12-bit to 16-bit ADCs with 6.5 V/us slew rate for fast settling times.

Key Specifications

Slew Rate 6.5V/us
Output Type Rail-to-Rail
Mounting Type Surface Mount
Amplifier Type CMOS
Package / Case 8-SOIC (0.154", 3.90mm Width)
Current - Supply 538uA (x2 Channels)
Number of Circuits 2
Current - Input Bias 0.5 pA
Operating Temperature -40degC ~ 125degC (TA)
Gain Bandwidth Product 10 MHz
Voltage - Input Offset 300 uV
Supplier Device Package 8-SOIC
Current - Output / Channel 50 mA
Voltage - Supply Span (Max) 5.5 V
Voltage - Supply Span (Min) 1.8 V

Getting Started

To evaluate the TLV9062IDR, engineers can use the DIP-ADAPTER-EVM to convert the 8-SOIC package for breadboard prototyping. Ensure that a 0.1 uF ceramic bypass capacitor is placed as close as possible to the V+ pin to maintain stability and performance. For simulation, TI provides PSpice and TINA-TI models to verify circuit stability and frequency response.

Also Consider

TLV9002IDR TITexas Instruments - A lower-power alternative (1 MHz bandwidth) for applications where power consumption is more critical than speed.
The 2026 Embedded Online Conference