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TPA6132A2RTER

TITPA6132A2RTER

Texas Instruments
Amplifier IC Headphones, 2-Channel (Stereo) Class AB 16-WQFN (3x3)
Active5,279 in stock

Overview

The TPA6132A2 is a stereo Class AB DirectPath headphone amplifier designed to eliminate the need for large DC-blocking output capacitors. It operates from a supply voltage of 2.3V to 5.5V and provides a constant maximum output power of 25mW per channel into 16-ohm loads. The device features integrated click-and-pop suppression and high RF noise immunity for clean audio performance in mobile environments.

Why Choose This Part

The DirectPath architecture simplifies PCB layout and reduces BOM cost by removing the need for external DC-blocking capacitors. Engineers can select between four fixed gain settings (-6, 0, 3, or 6 dB) using internal resistors, while the integrated pop-suppression circuitry ensures a quiet power-up and power-down sequence.

Applications

Mobile Handsets
Provides high-quality stereo audio output for smartphones and tablets with minimal board space requirements.
Portable Media Players
Utilizes DirectPath technology to deliver excellent bass response without bulky output coupling capacitors.
Notebook Computers
Compliant with Windows Vista audio requirements and offers high power supply noise rejection to handle noisy digital rails.
Handheld Gaming Consoles
Maintains constant output power across the battery voltage range while protecting against short circuits and thermal overloads.

Key Specifications

Type Class AB
Features Depop, Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Output Type Headphones, 2-Channel (Stereo)
Mounting Type Surface Mount
Package / Case 16-WFQFN Exposed Pad
Voltage - Supply 2.3V ~ 5.5V
Operating Temperature -40degC ~ 85degC (TA)
Supplier Device Package 16-WQFN (3x3)
Max Output Power x Channels @ Load 25mW x 2 @ 16Ohm

Getting Started

To evaluate the chip, TI offers the TPA6132A2EVM evaluation module which provides easy access to all pins and gain configurations. Ensure the thermal pad of the 16-WQFN package is soldered to a ground plane for optimal heat dissipation and performance. Use 1uF ceramic capacitors for supply bypassing and input coupling as recommended in the datasheet.